METHOD FOR MAKING THIN SEMICONDUCTOR DICE
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Abstract
A PROCESS FOR MAKING THIN SEMICONDUCTOR DEVICES WHEREIN THE SEMICONDUCTOR WAFER STARTING MATERIAL IS INITIALLY LAPPED TO A VERY THIN VALUE. GLASS AND A DUMMY SUBSTRATE ARE THEN SANDWICHED TO THE WAFER FOR FURTHER PROCESSING AND TO PREVENT BREAKAGE OF THE WAFER WHEN SEMICONDUCTOR DEVICES SUCH AS TRANSISTORS ARE CONSTRUCTED THEREIN. THEN THE GLASS AND DUMMY SUBSTRATE ARE REMOVED, LEAVING THIN SEMICONDUCTOR DICE HAVING A VERY LOW THERMAL RESISTANCE TO HEAT EMANATING FROM PN JUNCTIONS THEREIN.
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