TERMINAL PAD FOR PERFORATED CIRCUIT BOARDS AND SUBSTRATES

• US 3,567,844 A
• Filed: 06/23/1969
• Issued: 03/02/1971
• Est. Priority Date: 06/23/1969
• Status: Expired due to Term

• Current Assignee: Ludwig L. Krcmar
• Original Assignee: Ludwig L. Krcmar
• Inventors: Krcmar, Ludwig L.
• Application Number:
  US04/835,567
• Time in Patent Office: 617 Days
• US Class Current: 174/268
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 1/116 Lands, clearance holes or other lay-out details concerning the surrounding of a via
• CPC Class Codes: H05K 2201/09463 Partial lands, i.e. lands or conductive rings not completely surrounding the hole landless plated-through hole or via H05K2201/09545
• CPC Class Codes: H05K 2203/044 Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: H05K 3/3468 Applying molten solder

Abstract

Printed terminal pad structure is formed on a circuit board or substrate surface around and adjacent to the periphery of a terminal pin opening, the pad structure being characterized by a radially extending slot of appropriate width therein to prevent the pin opening from being plugged during a subsequent dip soldering process when a coating of solder is applied to the exposed surface of the pad structure. A solder-coated terminal pad around a solder-free terminal pin opening is thus obtained from the printed terminal pad structure.

Claims

1. A terminal pad structure for a perforated printed circuit substrate including a terminal pin opening therein, said pad structure comprising:

a printed circuit layer on a surface of said substrate, said circuit layer including a printed pad having a pad opening aligned with said terminal pin opening in said substrate; and

a slot extending laterally and vertically through said printed pad and connecting said pad opening with said surface of said substrate surrounding said printed pad, said slot having a width which prevents said pin opening from being plugged during a subsequent solder application process.

2. The invention as defined in claim 1 including a coating of solder on the exposed surfaces of said printed circuit layer.

3. The invention as defined in claim 1 wherein said pad opening is larger than said pin opening whereby a relatively small spacing is provided between the peripheries of said pad and pin openings.

4. The invention as defined in claim 3 including a coating of solder on the exposed surfaces of said printed circuit layer.

5. The inveNtion as defined in claim 1 wherein said slot extends in a generally radial direction from the center of said pad opening and is a gap of relatively uniform width.

6. The invention as defined in claim 5 including a coating of solder on the exposed surfaces of said printed circuit layer.