OPTICAL SEMICONDUCTOR DEVICE

• US 3,581,162 A
• Filed: 07/01/1969
• Issued: 05/25/1971
• Est. Priority Date: 07/01/1969
• Status: Expired due to Term

• Current Assignee: Wheatley William Richard
• Original Assignee: Wheatley William Richard
• Inventors: WHEATLEY WILLIAM RICHARD
• Application Number:
  US04/838,198
• Time in Patent Office: 693 Days
• US Class Current: 257/88
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21W 2111/00 Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
• CPC Class Codes: F21Y 2107/40 on the sides of polyhedrons, e.g. cubes or pyramids
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/4823 connecting the wire to a pin of the item
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/83801 Soldering or alloying
• CPC Class Codes: H01L 24/26 Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01083 : Bismuth [Bi]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12036 : PN diode
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 : characterized by the materials

Abstract

An optical semiconductor device comprises a metal supporting member having a mounting stem, a flat head on one end of the stem and a hub on the head. The hub has an end surface and a peripheral surface. A plurality of electroluminescent semiconductor diodes are mounted in spaced relation on the peripheral surface of the hub so that the supporting member is one terminal of each of the diodes. A terminal wire extends through and is insulatingly supported on the head of the supporting member. The terminal wire is electrically connected to each of the diodes so as to be the other terminal of the diodes. The diodes are all positioned so that they are adapted to emit light in the same direction away from the head of the supporting member. An additional electroluminescent semiconductor diode may be mounted on the end surface of the hub and electrically connected to the supporting member and the terminal wire. The additional diode is also adapted to emit light in the same direction as the other diodes.

Claims

2. An optical semiconductor device in accordance with claim 1 in which the peripheral surface of the supporting member is polyhedral and each of the elements is mounted on a separate face of the peripheral surface.

3. An optical semiconductor device in accordance with claim 2 including a separate active electroluminescent semiconductor element on each of the faces of the peripheral surface.

4. An optical semiconductor device in accordance with claim 3 including an additional active electroluminescent semiconductor element mounted on the end surface of the supporting member, said additional element having adjacent P-type and N-type regions with a light-emitting PN junction therebetween, one of said regions being electrically connected to said end surface, and means electrically connecting the terminal wire to the other region of said additional element.

5. An optical semiconductor device in accordance with claim 3 in which the supporting member includes a mounting stem, a flat head on one end of the stem and a hub on the head, said hub having the end surface and the peripheral surface on which the elements are mounted.

6. An optical semiconductor device in accordance with claim 5 in which the terminal wire extends through the head of the supporting member and is insulatingly supported on said head.

7. An optical semiconductor device in accordance with claim 6 in which the means electrically connecting the terminal wire to each of the elements comprises a separate wire electrically connected at one end to the terminal wire and at the other end to a respective one of the elements.

8. An optical semiconductor device in accordance with claim 5 in which the longitudinal axis of the hub is in alignment with the longitudinal axis of the stem.