LASER ENCODING OF DIODE ARRAYS

• US 3,584,183 A
• Filed: 10/03/1968
• Issued: 06/08/1971
• Est. Priority Date: 10/03/1968
• Status: Expired due to Term

• Current Assignee: Allen D. Sypherd, Frank L. Chiaretta, James A. Luisi
• Original Assignee: Allen D. Sypherd, Frank L. Chiaretta, James A. Luisi
• Inventors: Chiaretta, Frank L., Luisi, James A., Sypherd, Allen D.
• Application Number:
  US04/764,680
• Time in Patent Office: 978 Days
• US Class Current: 219/121.69
• CPC Class Codes: G11C 17/06 using diode elements G11C17/14 takes precedence
• CPC Class Codes: H01L 23/525 with adaptable interconnections
• CPC Class Codes: H01L 23/5258 the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H10B 20/00 Read-only memory [ROM] devices
• CPC Class Codes: Y10S 148/071 Heating, selective
• CPC Class Codes: Y10S 148/15 Silicon on sapphire SOS
• CPC Class Codes: Y10S 257/926 Elongated lead extending axially through another elongated lead

Abstract

A method and means for encoding a silicon-on-sapphire diode array by bombarding selected diodes or diode connections with a pulsed laser beam to burn away chosen silicon and metallization areas. Removal of these areas from the diode matrix constitutes an encoding process by elimination of the selected connection and/or diode.

Claims

2. The method of claim 1 wherein said pulsed laser beam is focused on said diode connections through said sapphire substrate.

3. The method of claim 1 wherein said pulsed laser beam is focused directly onto the diode connection.

4. A system for encoding a diode array fabricated on a dielectric substrate, said diode array comprising a plurality of rows and columns of conductors having diodes initially connected between each of said rows and columns of conductors, said system comprising, laser means for bombarding selected diode connections with a pulsed laser beam for electrically removing said selected diode connections, means for sequentially moving said laser means from one selected diode connection to another selected diode connection until the diode array is completely encoded.

5. A method for encoding a diode array fabricated on a dielectric substrate, said array having diodes initially connected between rows and columns of conductors, said method comprising the step of, positioning a laser at a selected diode location, pulsing said laser for producing a pulsed laser beam, said beam burning away the diode.

6. A system for encoding a diode array fabricated on a dielectric substrate, said diode array comprising a plurality of rows and columns of conductors having diodes initially connected between each of said rows and columns of conductors, said system comprising, laser means for bombarding selected diodes for electrically removing diodes from selected connections, means for sequentially moving said laser means from one selected diode to another selected diode until the diode array is completely encoded.