HIGH TEMPERATURE PHOTORESIST OF CROSS-LINKED POLY(2,6-DIMETHYL-1,4-PHENYLENE OXIDE)
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Abstract
POLY (2,6-DIMETHYL-1,4-PHENYLENE OXIDE) IS USED AS A PHOTORESIST IN THE PREPARATION OF LETTERPRESS PLATES REQUIRING THE USE OF ETCHANTS UNDER DRASTIC CONDITIONS, SUCH AS SULFURIC ACID AT TEMPERATURES OF 140-150*C. THE RESIST IS APPLIED TO THE PLATE FROM A SOLUTION IN A CHLORINATED ETHYLENE, PREFERABLY TRICHLOROETHYLENE AND CONTAINING A PEROXIDE SUCH AS T-BUTYLPERBENZOATE, A CROSS-LINKING AGENT, E.G., THE DIACRYLATE OF BIS-HYDROXYETHYL TEREPHTHALATE AND THIOXANTHEN-9-ONE AS PREFERRED SENSITIZER. THE RESIST IS PARTICULARLY EFFECTIVE AS APPLIED TO PLATES COMPOSED OF CELCON, AN ACETAL COPOLYMER.
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