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CONSTANT-TEMPERATURE-PULSED THERMOCOMPRESSION BALL BONDER SYSTEM

  • US 3,602,684 A
  • Filed: 10/27/1969
  • Issued: 08/31/1971
  • Est. Priority Date: 10/27/1969
  • Status: Expired due to Term
First Claim
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1. An apparatus for bonding conductive materials, said apparatus comprising;

  • a. a bonding tip adapted to be heated with an electrical current and having a resistance that increases with increases in temperature;

    b. means for heating said bonding tip with current pulses of substantially constant peak amplitude whereby the voltage drop thereacross increases with increases in temperature;

    c. means for sensing a predetermined peak voltage across said bonding tip which occurs whenever its temperature rises to a preselected operating temperature, and d. means responsive to said predetermined peak voltage for commencing a work cycle and for controlling said means for heating said bonding tip to maintain the temperature of said bonding tip substantially at said operating temperature during said work cycle.

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