METHOD OF MOUNTING A PIEZOELECTRIC DEVICE

• US 3,612,922 A
• Filed: 11/10/1970
• Issued: 10/12/1971
• Est. Priority Date: 11/10/1970
• Status: Expired due to Term

• Current Assignee: Thomas J. Furnival
• Original Assignee: Thomas J. Furnival
• Inventors: Furnival, Thomas J.
• Primary Examiner(s): Duggan, D. F.
• Assistant Examiner(s): Budd, Mark O.
• Application Number:
  US05/088,455
• Time in Patent Office: 336 Days
• Field of Search: 310/9.1-9.4,9.6,8.2 333/72
• US Class Current: 310/351
• CPC Class Codes: H03H 9/09 Elastic or damping supports
• CPC Class Codes: Y10T 29/42 Piezoelectric device making

Abstract

A thick film hybrid integrated circuit including an integrally mounted ceramic filter. A circular ceramic resonator disk having a central aperture therein is seated on a pedestal contact upstanding on a circuit board. The disk is supported on a shoulder of the pedestal so that it is free to resonate in the radial mode. A spring contact secured to the board contacts the exposed face of the disk to retain the disk against the pedestal shoulder.

Claims

1. A thick film hybrid integrated circuit assembly that includes an integrally mounted piezoelectric transducer, said assembly comprising a ceramic substrate, a cermet circuit pattern bonded to one face of said substrate, two conductor portions in said circuit pattern for connecting a piezoelectric transducer into said circuit, an upstanding pedestal attached to said substrate face, a shoulder on the pedestal spaced from said face, a low resistance electrical connection between said shoulder and one of said conductor portions, an annular piezoelectric transducer disk having opposed conductive faces and a central aperture nested on said pedestal, one of said conductive disk faces seated on said shoulder and said pedestal projecting through said aperture beyond the other disk face, a leaf spring contact pressing against said other disk face with the pedestal projecting through a leaf spring aperture, an end of the leaf spring rigidly attached to said substrate, and a low resistance electrical connection between said leaf spring and the other circuit conductor portion.

2. A thick film hybrid integrated circuit assembly that includes an integrally mounted piezoelectric transducer, said assembly comprising a ceramic substrate having at least two apertures therein, a cermet circuit pattern bonded to one face of said substrate, a separate conductor portion in said circuit pattern adjacent each of said apertures for connecting a piezoelectric transducer into said circuit, an upstanding pedestal rigidly seated in one of said substrate apertures and contacting the adjacent conductor portion, a shoulder on the pedestal spaced from the substrate face, a low resistance electrical connection between said shoulder and said adjacent conductor portion, an annular piezoelectric transducer disk having opposed conductive faces and a central aperture nested on said pedestal, one of said conductive seated on said shoulder and said pedestal projecting through said disk aperture beyond the other disk face, a leaf spring contact pressing against the other face of said disk with the pedestal projecting through a leaf spring aperture, and an end of the leaf spring fastened to said substrate through the other substrate aperture and soldered to the other conductor portion.

3. A thick film hybrid integrated circuit assembly that includes an integrally mounted piezoelectric transducer, said assembly comprising a ceramic substrate having at least two apertures therein, a cermet circuit pattern bonded to one face of said substrate, a first conductor portion in said circuit pattern surrounding one of said apertures and a second conductor Portion at least adjacent the other for connecting a piezoelectric transducer into said circuit, a nonconductive rod upstanding on said face with its lower end bonded within said one substrate aperture a conductive ferrule on said rod soldered to said first conductor portion and providing a contact shoulder spaced from the surface of said substrate, an annular piezoelectric transducer disk having opposed conductive faces and a central aperture nested on said rod, one of said conductive faces seated on said shoulder and said rod projecting through said aperture beyond the other disk face, a bifurcated end of an L-shaped leaf spring pressing against the other face of said disk around said rod, the other end of the leaf spring crimped to said substrate through the other substrate aperture and soldered to said second conductor portion.