AIR-COOLING SYSTEM FOR HVDC VALVE WITH STAGGERED RECTIFIERS

• US 3,646,400 A
• Filed: 12/21/1970
• Issued: 02/29/1972
• Est. Priority Date: 12/21/1970
• Status: Expired due to Term

• Current Assignee: CGEE Alsthom North America Incorporated
• Original Assignee: Arnold I. Shore, Donald M. Demarest
• Inventors: Demarest, Donald M., Shore, Arnold I.
• Primary Examiner(s): Myers, Lewis H.
• Assistant Examiner(s): Tolin, Gerald P.
• Application Number:
  US05/099,893
• Time in Patent Office: 435 Days
• Field of Search: 174/15R,16R,DIG.5 321/8C 317/100,234A
• US Class Current: 361/689
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 25/03 all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 7/14339 specially adapted for high voltage operation
• CPC Class Codes: H05K 7/20909 Forced ventilation, e.g. on heat dissipaters coupled to components
• CPC Class Codes: Y10S 257/909 Macrocell arrays, e.g. gate arrays with variable size or configuration of cells

Abstract

Disclosed is a housing arrangement for a plurality of rectifier holding assemblies comprising a solid-state valve(s) of a highvoltage converter. The assemblies are mounted on panel structures which are disposed between sidewalls arranged parallel to and laterally offset from each other to form inlet ducts through which a cooling fluid may be brought to the assemblies and outlet ducts through which the cooling fluid from the assemblies exits. The cross-sectional area of the inlet and outlet duct portions adjacent the panel structures are such that the pressure drop in said portions are equal. Inlet and outlet ducts are mated together to decrease housing size.

Claims

1. In high-voltage electrical apparatus composed of a plurality of semiconductor rectifiers held in heat-dissipating assemblies mounted on supporting panel structures in a housing, said housing having sidewalls enclosing said panel structures and having entrance and exit apertures for the ingress and egress of cooling fluid to the housing, the improvement comprising:

means mounting selected panel structures in an arrangement which forms walls of a pair of ducts in said housing through which the cooling fluid is made to flow, said ducts being disposed on opposite sides of said panel strucTures with portions thereof adjacent thereto, a first one of said ducts communicating with said entrance aperture for carrying the cooling fluid to the mounted assemblies, the other of said ducts communicating with said exit aperture for carrying said fluid away from said assemblies, said panel structures being disposed generally parallel to and laterally offset from each other so that the portion of the first duct adjacent one panel structure has a smaller cross sectional area than the portion of the same duct adjacent the panel structure disposed immediately upstream in the fluid flow and the portion of the other duct adjacent said one panel structure has a larger cross-sectional area than the portion of that duct adjacent said upstream panel structure, the cross-sectional areas of said duct portions being such that the pressure drop in each portion of the duct adjacent each panel is approximately equal.

2. The electrical apparatus as specified in claim 1 wherein said panel structures include apertures which communicate with the assemblies mounted thereon and which enable the cooling fluid from the inlet duct to pass through said assemblies and into the outlet duct.

3. The electrical apparatus as specified in claim 2 wherein said panel structures each comprise a single panel.

4. The electrical apparatus as specified in claim 2 wherein said panel structures each comprise a plurality of closely spaced panels which are oriented parallel to one another and whose apertures are aligned.

5. In a high-voltage electrical apparatus composed of a plurality of semiconductor rectifiers held in heat-dissipating assemblies mounted on supporting panel structures in a housing, said housing having sidewalls enclosing said panel structures and having entrance and exit apertures for the ingress and egress of cooling fluid to the housing, the improvement comprising means mounting selected panel structures in an arrangement which forms walls of at least three ducts in said housing through which the cooling fluid is made to flow, said ducts being disposed on opposite sides of said panel structures with portions thereof adjacent hereto, a first one of said ducts communicating with said entrance aperture for carrying the cooling fluid to the mounted assemblies, a second duct communicating with an exit aperture for carrying said fluid away from some of said assemblies and a third duct communicating with an exit aperture for carrying said fluid away from the other of said assemblies, said panel structures being disposed in two groups, the panel structures in each group being generally parallel to and laterally offset from each other, said groups being disposed opposite each other to form said first duct therebetween, said first duct being of maximum cross sectional area at said inlet aperture and becoming progressively smaller in cross sectional area adjacent each panel structure in the downstream direction so that the pressure drop in each portion of the duct adjacent each panel structure is approximately equal.

6. The apparatus as described in claim 5 wherein said panel structures each comprise a single panel.

7. The apparatus as described in claim 5 wherein said panel structures each comprise a plurality of closely spaced panels which are oriented parallel to one another.