METHOD OF BONDING EMPLOYING HIGH FREQUENCY ALTERNATING MAGNETIC FIELD

• US 3,657,038 A
• Filed: 06/26/1969
• Issued: 04/18/1972
• Est. Priority Date: 07/31/1968
• Status: Expired due to Term

• Current Assignee: W.R. Grace & Co.-Conn. (WR Grace & Company)
• Original Assignee: David Reginald Lightfoot
• Inventors: Lightfoot, David Reginald
• Primary Examiner(s): Quarforth, Carl D.
• Assistant Examiner(s): Lechert, Jr., Stephen J.
• Application Number:
  US04/836,803
• Time in Patent Office: 1,027 Days
• Field of Search: 156/106,276,275,309,99,327,291
• US Class Current: 156/106
• CPC Class Codes: B29C 65/3612 comprising fillers
• CPC Class Codes: B29C 65/368 with a polymer coating
• CPC Class Codes: B29C 65/3696 with a coating
• CPC Class Codes: B29C 66/00 General aspects of processes or apparatus for joining preformed parts means for handling the parts to be joined B29C65/78; testing the joint B29C65/82
• CPC Class Codes: B29C 66/7465 Glass
• CPC Class Codes: B29K 2705/00 Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
• CPC Class Codes: B29K 2709/08 Glass
• CPC Class Codes: B29K 2711/14 Wood, e.g. woodboard or fibreboard
• CPC Class Codes: B32B 17/10174 Coatings of a metallic or dielectric material on a constituent layer of glass or polymer
• CPC Class Codes: B32B 17/10871 in combination with particular heat treatment
• CPC Class Codes: B32B 27/00 Layered products comprising a layer of synthetic resin fibrous or filamentary layer made of a synthetic resin B32B5/02; particulate layer made of a synthetic resin B32B5/16; foamed layer made of a synthetic resin B32B5/18
• CPC Class Codes: C03C 27/10 with the aid of adhesive specially adapted for that purpose

Abstract

This invention is directed to a method for effecting adhesion between two substrates, at least one of which is glass, which comprises forming an assembly to be bonded by interposing between the substrates and in contact with both, a thermally activatable adhesive composition containing particles of a material which is ferromagnetic or electrically conductive or both, and subjecting the assembly to the action of a high frequency alternating magnetic field until the adhesive has become activated.

Claims

2. The method according to claim 1 wherein said particles have an average diameter of 30- 1000 microns.

3. The method according to claim 1 wherein said electrically conducting non-ferromagnetic particles are selected from the group consisting of carbon, copper, silver, gold, aluminum, silicon, alloys of aluminum and silicon and alloys of aluminum and copper.

4. The method according to claim 1 wherein the electrically conducting, ferromagnetic particles are selected from the group consisting of iron, nickel, cobalt, ferromagnetic alloys of iron and nickel, nickel and chromium, nickel and manganese and stainless steel.

5. The method according to claim 1 wherein the polymeric material is a member of the group consisting of polyolefin, vinyl polymer, polyamide, polyesters, and formaldehyde copolymers.

6. The method according to claim 5 wherein the polyolefin is a member of the group consisting of polyethylene, oxidized polyethylene, polypropylene and ethylene/propylene copolymers.

7. The method according to claim 1 wherein one of the substrates is glass and the other is a polymeric material.

8. The method according to claim 1 wherein one of the substrates is glass and the other is a metal.

9. The method according to claim 1 in which there is formed an assembly of two substrates spaced apart by at least one spacer, the adhesive composition being interposed between each substrate and the, or each spacer.

10. The method according to claim 9 wherein the spacer is lead.

11. The method according to claim 9 wherein the spacer is a polymeric material.

12. The method according to claim 11 wherein the adhesive composition is interposed by embodying the adhesive composition in appropriate surfaces of the spacer.

13. The method according to claim 12 wherein the composition is embodied in the surface of the spacer by prelaminating strips of the adhesive composition to a strip of the polymeric spacer material.