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PROCESS FOR BONDING PREHEATED THERMOPLASTIC FILM TO A DISSIMILAR SUBSTRATE

  • US 3,660,200 A
  • Filed: 07/09/1969
  • Issued: 05/02/1972
  • Est. Priority Date: 07/09/1969
  • Status: Expired due to Term
First Claim
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2. The method of claim 1 wherein:

  • A. the film is low density polyethylene, B. the nip rolls are maintained at a temperature of from about 210* F. to about 275* F., C. the substrate is kraft paper, and D. substantially just prior to passing through said nip section the paper is heated to a temperature of from about 250* F. to about 300* F.

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