MULTI-IMPEDANCE ELECTRICAL COMPONENT
First Claim
1. A multi-impedance electrical component comprising at least one circuit wafer, a plurality of discrete film type impedance elements supported on and bonded to the circuit wafer, said impedance elements being spaced from each other and lying in a resistance path, a plurality of conductive interconnectors having an impedance terminating portion electrically connected to said impedance elements, each of the conductive interconnectors having second portions supported flatwise on the circuit wafer in a desired spatial array, a rotary impedance selecting means assembled with the circuit wafer, the impedance selecting means comprising a conductive contactor and a driver means for selectively moving the conductive contactor in a circuitous path to different preselected contact positions and electrically connecting the contactor to one of the interconnectors, the second portions of the conductive interconnectors being spaced at intervals along an arcuate path on the circuit wafer, the impedance elements being supported on the circuit wafer radially outwardly of the arcuate path and spaced from the circuitous path engageable by the conductive contactor to present wiping engagement of the conductive contactor with the impedance elements lying in the resistance path when the contactor is moved from one of the interconnectors to another of the interconnectors, and an impedance selecting means actuator connected to the driver means for imparting motion thereto.
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Accused Products
Abstract
Multi-impedance electrical component having an impedance selecting means assembled with at least one circuit wafer supporting a plurality of operationally discrete film type impedance elements, i.e., film type elements supported in groups on the wafer to form a single integrated mechanical structure, the film type impedance elements being useful in an electrical circuit in lieu of structurally independent resistors, capacitors, and inductors. Film type conductive interconnectors are connected with the operationally discrete impedance elements and a conductive contactor forming part of the impedance selecting means is movable to different contact positions for completing an electrical connection with selected ones of the conductive interconnectors. An indexical detent mechanism cooperates with a shaft for selectively changing the position of the conductive contactor, operation of the shaft causing one or more of the operationally discrete impedance elements to be connected in a circuit between termination points on the wafer. The wafer is formed of heat resistant material, and the operationally discrete impedance elements are formed from film type material and are precisely adjusted to a nominal impedance value by removing portions of the film from the surface of the wafer.
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Citations
8 Claims
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1. A multi-impedance electrical component comprising at least one circuit wafer, a plurality of discrete film type impedance elements supported on and bonded to the circuit wafer, said impedance elements being spaced from each other and lying in a resistance path, a plurality of conductive interconnectors having an impedance terminating portion electrically connected to said impedance elements, each of the conductive interconnectors having second portions supported flatwise on the circuit wafer in a desired spatial array, a rotary impedance selecting means assembled with the circuit wafer, the impedance selecting means comprising a conductive contactor and a driver means for selectively moving the conductive contactor in a circuitous path to different preselected contact positions and electrically connecting the contactor to one of the interconnectors, the second portions of the conductive interconnectors being spaced at intervals along an arcuate path on the circuit wafer, the impedance elements being supported on the circuit wafer radially outwardly of the arcuate path and spaced from the circuitous path engageable by the conductive contactor to present wiping engagement of the conductive contactor with the impedance elements lying in the resistance path when the contactor is moved from one of the interconnectors to another of the interconnectors, and an impedance selecting means actuator connected to the driver means for imparting motion thereto.
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2. The electrical component of claim 1 wherein the circuit wafer is provided with at least one denuded area contiguous with one of the discrete film type impedance elements, the size and location of the denuded area determining the nominal magnitude of the electrical impedance of the contiguous impedance element.
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3. The structure of claim 1 wherein the component includes a pair of termination points, the impedance selecting means includes an indexical detent means having index positions corresponding to the different preselected contact positions of the conductive contactor and the film type impedance elements are connected in a series circuit configuration by the conductive interconnectors, movement of the conductive contactor between two of the preselected contact positions in one direction increasing the number of impedance elements effectively in the electrical circuit between the pair of termination points, and movement of the conductive contactor in the opposite direction between two of the preselected contact positions decreasing the number of impedance elements effectively in the electrical circuit between the pair of termination points.
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4. An electrical component having a frame, a shaft supported for rotation by the frame, a circuit wafer held fixed relative to the frame, a plurality of discrete film type impedance elements supported flatwise on and bonded to the circuit wafer, said impedance elements being spaced from each other and lying in a resistance path, a first termination means electrically connected to at least one of the discrete film type impedance elements, a second termination means electrically connected to another of the discrete film type impedance elements and spaced from the first termination means, a plurality of conductive interconnectors supported on the wafer, the conductive interconnectors being electrically connected to the discrete film type impedance elements, and a selector having a conductive contactor drivingly interconnected with the shaft for movement thereby, the impedance elements being supported on the circuit wafer radially outwardly of the selector to prevent wiping engagement of the conductive contactor with the impedance elements lying in the resistance path when the contactor is moved from one of the interconnectors to another of the interconnectors, said selector having means electrically connected to said second termination means and movable to a preselected contact position for completing an electrical circuit between said one of the conductive interconnectors and the second termination means whereby said at least one of the discrete film type impedance elements is connected in an electrical circuit between said first and second termination means.
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5. The electrical component of claim 4 wherein the circuit wafer is provided with at least one denuded area contiguous with one of the discrete film type impedance elements, the size and location of the denuded area determining the nominal magnitude of the electrical impedance of the contiguous impedance element.
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6. The electrical component of claim 4 wherein the selector includes a rotor supported for rotation relative to the circuit wafer and the rotor comprises bridging means for completing the electrical circuit between said one of the conductive interconnectors and the second termination means.
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7. The electrical component of claim 6 wherein the selector further comprises a stator body of insulating material and a plurality of terminals supported on the stator body with end portions thereof projecting therefrom, the rotor is supported for rotation on the stator body, the bridging means comprises a contactor engageable with the terminals, and the end portions of the terminals are electrically connected to the conductive interconnectors.
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8. The electrical component of claim 7 wherein the circuit wafer is provided with a plurality of passageways, and the end portions of the terminals are disposed in the passageways and cooperate therewith to mechanically hold the stator body in fixed relation to the circuit wafer.
Specification