ADHESIVE COMPOSITIONS CONTAINING EPOXY RESIN, CARBOXYL CONTAINING COPOLYMER AND 2,2,-BIS-(4-HYDROXYPHENYL) SULFONE

• US 3,678,131 A
• Filed: 09/10/1970
• Issued: 07/18/1972
• Est. Priority Date: 09/10/1970
• Status: Expired due to Term

• Current Assignee: Daniel L. Paradis, David K. Klapprott
• Original Assignee: Daniel L. Paradis, David K. Klapprott
• Inventors: Klapprott, David K., Paradis, Daniel L.
• Primary Examiner(s): Lieberman, Paul
• Application Number:
  US05/071,269
• Time in Patent Office: 677 Days
• Field of Search: 260/836,837
• US Class Current: 525/109
• CPC Class Codes: C08G 59/066 with chain extension or advancing agents
• CPC Class Codes: C08G 59/4284 together with other curing agents
• CPC Class Codes: C08G 59/621 Phenols
• CPC Class Codes: C08L 2666/04 Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
• CPC Class Codes: C09J 163/00 Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
• CPC Class Codes: Y10S 525/911 Polymer from ethylenic monomers only, having terminal functional group other than unsaturation

Abstract

The disclosure describes new adhesive compositions having improved toughness and excellent high temperature shear strength comprising the reaction product of a major amount of a polyepoxide with a minor amount of a reactive carboxyl group containing polymer and 2,2-bis(4-hydroxyphenyl)sulfone.

Claims

2. about 5-35 percent by weight of a carboxyl group containing addition copolymer in the presence of from 0.05 to 3 percent by weight of the reactants of a catalyst selected from the group consisting of tertiary amines, quaternary ammonium salts, organo-substituted phosphine and phosphonium halides and

3. An insoluble infusible product obtained by heating the composition of claim 2 at a temperature between about 50* and 200*C.

4. A composition as in claim 2 wherein the polyepoxide is a liquid glycidyl polyether of a polyhydric phenol.

5. A composition as in claim 4 wherein the polyhydric phenol is 2,2-bis(4-hydroxyphenyl)propane.

6. A composition as in claim 2 wherein the epoxy curing system includes an accelerator.

7. A composition as in claim 2 wherein the reactive, carboxyl group containing polymer is a polymer which contains at least 10 percent by weight of acrylonitrile units and a plurality of free carboxyl groups.

8. A composition as in claim 7 wherein the reactive, carboxyl group containing polymer is a copolymer of acrylonitrile and butadiene having a plurality of free carboxyl groups distributed on the polymer chain.

9. An insoluble, infusible epoxy containing composition comprising the cured reaction product of a major amount of the diglycidyl ether of 2,2-bis(4-hydroxylpenyl)propane, and about 5-35 percent by weight of a copolymer of acrylonitrile and butadiene having a plurality of free carboxyl groups and about 5-35 percent by weight of 2,2-bis(4-hydroxyphenyl)sulfone.

10. A process for preparing an acetone soluble epoxy-containing composition which comprises reacting at a temperature of about 50*-175*C.

11. A process as in claim 10 wherein the polyepoxide is a glycidyl polyether of a polyhydric phenol.

12. A process as in claim 10 wherein the catalyst is triphenyl phosphine.

13. A process as in claim 12 wherein the polyepoxide is the glycidyl polyether of 2,2-bis(4-hydroxyphenyl)-propane.

14. A process as in claim 10 wherein the reactive, carboxyl group containing polymer is a polymer which contains at least 10 percent by weight of acrylonitrile units and a plurality of free carboxyl groups.

15. A process as in claim 13 wherein the reactive, carboxyl group containing polymer is a copolymer of acrylonitrile and butadiene having a plurality of free carboxyl groups distributed on the polymer chain.