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SEMICONDUCTOR DEVICE PACKAGING

  • US 3,706,840 A
  • Filed: 05/10/1971
  • Issued: 12/19/1972
  • Est. Priority Date: 05/10/1971
  • Status: Expired due to Term
First Claim
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1. A process for packaging a semiconductor device comprising fusing glass to the central portion of a lead frame having leads and a mounting pad to form a glass base beneath such portion and an upstanding glass wall upon the frame surrounding the mounting pad and adjacent lead fingers of the frame to form a central rigid package portion, securing a semiconductor device upon the mounting pad and connecting device contacts to lead fingers within the wall of the central package portion, applying a conformal coating over the device and connections within the glass wall, and molding a plastic encapsulant about the central portion of the package enclosing the same with the extremities of the lead frame extending therefrom.

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