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MICROELECTRIC HEAT EXCHANGER PEDESTAL

  • US 3,710,251 A
  • Filed: 04/07/1971
  • Issued: 01/09/1973
  • Est. Priority Date: 04/07/1971
  • Status: Expired due to Term
First Claim
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1. A support pedestal for testing microelectronic devices comprising:

  • a. a heat exchange chamber having upper and lower plates, inlet and outlet manifolds positioned near opposite periphery regions of said lower plate for circulating temperature controlling fluids through said chamber, and a plurality of vacuum tubes extending through said chamber and said upper and lower plates, b. temperature control means including fluid reservoir means and fluid circulation means interconnecting said reservoir means to said inlet and outlet manifolds;

    c. vacuum chuck means for chucking devices subject to test to the upper surface of said upper plate including a vacuum chamber beneath said heat exchange chamber in vacuum communication with said plurality of vacuum tubes, and vacuum source means connected through vacuum communication means with said vacuum chamber;

    d. inert gas delivery means circumscribing said heat exchange chamber for providing an inert atmosphere over devices while subject to temperature testing;

    e. probe means including probes positioned above said heat exchange chamber for engaging microelectronic devices during test, and structural support means positioned around said gas delivery means and supporting said probes;

    f. positioning means for bringing microelectronic devices being tested into test engagement with said probe means; and

    g. an inverted shroud cup on said structural support means and cooperatively enclosing devices chucked to said upper plate and with said gas delivery means facilitating said inert atmosphere.

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