EVAPORATIVE COOLING AND HEAT EXTRACTION SYSTEM

• US 3,725,566 A
• Filed: 05/01/1972
• Issued: 04/03/1973
• Est. Priority Date: 05/01/1972
• Status: Expired due to Term

• Current Assignee: Bruno T. Plizak
• Original Assignee: Bruno T. Plizak
• Inventors: Plizak, Bruno T.
• Primary Examiner(s): Gilheany, Bernard A.
• Assistant Examiner(s): Grimley, A. T.
• Application Number:
  US05/247,398
• Time in Patent Office: 337 Days
• Field of Search: 174/15R,16R,DIG.5 313/21,35,36 317/234A 165/105,104,60,74 62/304,314,315,316,515,516,64
• US Class Current: 174/15.1
• CPC Class Codes: F28C 3/08 with change of state, e.g. absorption, evaporation, condensation generating steam under pressure F22
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: Y10S 165/903 Convection
• CPC Class Codes: Y10S 165/911 Vaporization

Abstract

Heat transfer is accomplished from electronic components by inserting simultaneously both a liquid coolant and a gas into a chamber having a high heat flux surface forming one side of the chamber. A porous membrane section forms on opposite side of the chamber and permits both the gas and a hot vapor formed from the water to escape. In operation the gaseous flow is used to break up the liquid coolant film that forms on the high heat flux surface.

Claims

2. A heat exchange system according to claim 1 further comprising:

said gas porous material adapted to be penetrable by gases and liquid vapor, and impervious to liquid.

3. A heat exchange system according to claim 2 wherein said heat source is a transistor.

4. A heat exchange system according to claim 1 wherein said housing and said spacer have adjacent passageways comprising said first inlet and adjacent passageways comprising said second inlet.

5. A heat exchange system according to claim 4 wherein said housing further comprises:

a third inlet adapted to provide a passageway for connecting electrical wiring to said heat source; and

an outlet adapted to discharge liquid, liquid vapor and gas.

6. A heat exchange system according to claim 5 further comprising:

said housing comprises inner threads;

said spacer being secured on said threads; and

a retaining ring adjacent to said porous material secured on said threads.

7. A heat exchange system according to claim 6 further comprising:

an end of said housing being substantially cylindrical in shape; and

a cap covering said end of said housing.

8. A heat exchange system according to claim 2 wherein said connecting means further comprises:

a spacer between said heat source and porous material; and

a heat conducting plate between said spacer and said heat source.

9. A heat exchange system according to claim 8 further comprising:

a cover connected to said heat conductor plate for forming an enclosure for said heat source.

10. A heat exchange system according to claim 9 further comprising:

an electrical connector connected to said cover; and

electrical wiring connected to said electrical connector and said heat source for providing electrical power to said heat source.