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SEMICONDUCTOR PACKAGE CONTAINING A DUAL EPOXY AND METAL SEAL BETWEEN A COVER AND A SUBSTRATE, AND METHOD FOR FORMING SAID SEAL

  • US 3,735,211 A
  • Filed: 06/21/1971
  • Issued: 05/22/1973
  • Est. Priority Date: 06/21/1971
  • Status: Expired due to Term
First Claim
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2. Structure as in claim 1 wherein said substrate comprises:

  • a ceramic material containing a top and a bottom surface;

    an annular-shaped dielectric formed over selected portions of said top surface; and

    an annular-shaped metal layer placed on said annular-shaped dielectric, said annular-shaped metal layer being larger than said annular-shaped epoxy preform.

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