HEAT DISSIPATION DEVICE

• US 3,746,087 A
• Filed: 04/19/1971
• Issued: 07/17/1973
• Est. Priority Date: 04/19/1971
• Status: Expired due to Term

• Current Assignee: Spectra-Physics Incorporated (MKS Instruments Incorporated)
• Original Assignee: Charles M. Eallonardo, Gordon R. Lavering
• Inventors: Lavering, Gordon R., Eallonardo, Charles M.
• Primary Examiner(s): O'Dea, William F.
• Assistant Examiner(s): Anderson, William C.
• Application Number:
  US05/135,472
• Time in Patent Office: 820 Days
• Field of Search: 165/185,180,181,81
• US Class Current: 165/185
• CPC Class Codes: F28F 1/10 Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses crimped or corrugated elements F28F1/06, F28F1/08
• CPC Class Codes: H01J 23/033 Collector cooling devices
• CPC Class Codes: H01J 7/24 Cooling arrangements; Heating arrangements; Means for circulating gas or vapour within the discharge space

Abstract

A device is disclosed for use in dissipating heat from a heated object when restrictions on expansion of the heated object and the heat dissipation device cause stresses in the device, in any containing structures and in the bonds at the interfaces of the device with other structures. The device is comprised of thin members which have been formed in a shape distorted from the lines normal to the surface of attachment of the members to the object. The members surround and are in thermal contact with the heated object. As the members and object expand and contract during temperature cycling, the members deform, allowing the heated object to move relative to surrounding structures, thus relieving stress. When such movement is constrained, the members are thin enough to relieve stress by deformation into the space between the members. A preferred embodiment of this device uses members which are shaped generally like a hollow truncated cone.

Claims

1. Means for dissipating heat from a component of an electrical apparatus through a structure spaced from and surrounding said component, said means comprising a plurality of adjacently disposed thermally conductive annular members surrounding and in bonded thermally conductive attachment to said component, each member having a deformable portion disposed generally angularly at other than a right angle with respect to the surface of attachment of said member to said component, said deformable portion of each member being spaced from the deformable portion of each adjacent member, and each member being in bonded thermally conductive attachment to said structure, said structure being made of electrically insulating material.

2. The heat dissipating means as claimed in claim 1 wherein said component is attached to meaNs preventing movement of said component relative to said structure.

3. The heat dissipating means as claimed in claim 1 wherein said structure is a ceramic cylinder and said component is on the axis of said cylinder.

4. The heat dissipating means as claimed in claim 1 wherein each of said members is shaped generally like a hollow truncated cone.

5. The heat dissipating means as claimed in claim 4 wherein said truncated cone has inner and outer peripheral rims extending parallel to the axis of said cone.

6. The heat dissipating means as claimed in claim 5 wherein said inner and outer peripheral rims extend in opposite directions. 7, The heat dissipating means as claimed in claim 1 wherein said thermally conductive annular members are bonded by a braze to said component of an electrical apparatus and are also bonded by a braze to said electrically insulating structure.

8. The heat dissipating means as claimed in claim 1 wherein at least one of said thermally conductive annular members is hermetically bonded to said component of an electrical apparatus and to said electrically insulating structure.

9. The heat dissipating means as claimed in claim 1 wherein said component of said electrical apparatus is an electrode.

10. The heat dissipating means as claimed in claim 9 wherein said electrical apparatus is an arc lamp.

11. The heat dissipating means as claimed in claim 10 wherein said arc lamp comprises (a) a sealed envelope comprising a base, an optical window opposite said base, and means to support said window apart from said base, (b) two electrodes supported within said envelope and spaced apart to define an arc gap therebetween, (c) an ionizable gas filling said arc gap, and (d) a reflector supported within said envelope;

wherein said base comprises a hollow ceramic cylinder that surrounds and is in thermally conductive attachment to said annular members and is the structure through which heat from one of said electrodes is dissipated, said one electrode having a portion coaxially disposed in said ceramic cylinder; and

wherein said annular members surround and are in thermally conductive attachment to said one electrode.

12. The heat dissipating means as claimed in claim 9 wherein said electrical apparatus is a travelling wave tube amplifier and said electrode is an electron beam striker.

13. The heat dissipating means as claimed in claim 12 wherein said travelling wave tube amplifier comprises (a) means for forming and projecting a beam of electrons over an elongated beam path, and (b) means forming a periodic slow wave circuit arranged along said electron beam for electromagnetic interaction between a forward travelling wave on said circuit and said beam of electrons to produce an amplified output signal on said circuit;

and wherein said means for projecting said beam of electrons includes a beam collector structure comprising (1) a beam striker, (2) a ceramic cylinder that surrounds and is in thermally conductive attachment to said annular members and is the structure through which heat from said beam striker is dissipated, said beam striker having a portion coaxially disposed in said ceramic cylinder, and (3) said annular members that surround and are in thermally conductive attachment to said beam striker.