SEMICONDUCTOR LEAD BONDING MACHINE

• US 3,747,829 A
• Filed: 12/13/1971
• Issued: 07/24/1973
• Est. Priority Date: 12/13/1971
• Status: Expired due to Term

• Current Assignee: Lucien A. Hofmeister
• Original Assignee: Lucien A. Hofmeister
• Inventors: Hofmeister, Lucien A.
• Primary Examiner(s): Lazarus, Richard B.
• Application Number:
  US05/207,666
• Time in Patent Office: 589 Days
• Field of Search: 228/1,25,28,4,29,32 29/23P
• US Class Current: 228/29
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates

Abstract

A machine for bonding a series of prearranged elements such as connector pads of circuit portions of semiconductor devices to other allied circuits and comprising a bonding tool adapted to overlie the elements, and means for moving the tool successively into sequential pressure contact with the elements and in a path having a spiral configuration to effect the bonding in an improved and more efficient manner.

Claims

1. A machine for bonding a plurality of members to a substrate having the members positioned thereon, comprising a support for said substrate, a bonding tool mounted for movement toward and away from the plurality of members to be bonded and having an end shaped for engagement with said members, and operating means for moving said bonding tool so as to cause said end to move into engagement successively with the members for bonding the members to the substrate, wherein said end of the bonding tool moves in a spiral path and engages each member a plurality of times, each time in a different area.

2. A machine for bonding a plurality of members to a substrate having the members positioned thereon, comprising a support for said substrate, a bonding tool mounted for movement toward and away from the plurality of members to be bonded and having an end shaped for engagement with said members, and operating means for moving said bonding tool so as to cause said end to move into engagement successively with the members for bonding the members to the substrate, wherein said operating means includes a rocker plate pivotal about a first axis, and tool-supporting apparatus carried by said rocker plate for movement therewith and pivotal individually about a sEcond axis perpendicular to and intersecting said first axis, said tool being mounted on said apparatus and disposed on a third axis passing through said first and second axes, with said end of the tool being located at the intersection of said axes.

3. A machine as set forth in claim 2 wherein means is connected to said tool-supporting apparatus for altering the angle at which said third axis and tool are disposed with respect to said first and second axes.

4. A machine for bonding a plurality of members to a substrate having the members positioned thereon, comprising a support for said substrate, a rocker plate pivotal about a first axis, tool-supporting apparatus carried by said rocker plate for movement therewith and independently pivotal about a second axis perpendicular to and intersecting said first axis, and a bonding tool mounted on said tool-supporting apparatus and having an end shaped for engagement with said members, said tool being disposed on a third axis passing through said members to be bonded and through said intersection of said first and second axes, with said end of the tool being positioned at said intersection.

5. A machine as set forth in claim 4 which additionally comprises operating means connected to said tool-supporting apparatus for causing movement thereof about said second axis.

7. A machine as set forth in claim 4 which additionally comprises operating means connected to said tool-supporting apparatus and rocker plate for moving same about said first and second axes and for simultaneously causing said end of the tool to move into engagement successively with the members for bonding the members to the substrate.

8. A machine as set forth in claim 7 wherein said operating means functions through said apparatus and rocker plate to alter the angle at which said third axis and tool are disposed with respect to said first and second axes.

9. A machine as set forth in claim 7 wherein said operating means functions through said apparatus and rocker plate to move the tool in a manner such that said end thereof successively engages the members for bonding the same to the substrate.

10. A machine as set forth in claim 9 wherein said end of the tool engages the members throughout a path which is of spiral configuration whereby each member is engaged by the tool a plurality of times, each time in a different area.

11. A machine for bonding a plurality of elements to a substrate having the elements positioned thereon, comprising a support for said substrate, a first member pivotal about a first axis, tool-supporting apparatus carried by said first member for movement therewith and independently pivotal about a second axis perpendicular to and intersecting said first axis, a bonding tool mounted on said tool-supporting apparatus and having an end shaped for engagement with said members, said tool being disposed on a third axis passing through said members to be bonded and through said intersection of said first and second axes, with said end of the tool being positioned at said intersection, and operating means connected to said tool-supporting apparatus for moving said end of the tool into successive engagement with said members for performing individual bonding operations at each member throughout a spiral path passing successively through said members a plurality of times whereby each member is bonded to the substrate in a different area upon each such engagement.

12. A machine as set forth in claim 11 wherein said operating means comprises rotational means having an opening therein, a movable members within said opening and movable diametrically within said opening upon rotation of said rotational means, said third axis passing eccentrically through said movable member, an arm fixed at one end to said apparatus and pivotally connected at its other end to said movable member at the point of intersectiOn by said third axis, and means for rotating said rotational means and moving said movable member and consequently causing movement of said tool.

13. A machine as set forth in claim 12 wherein said rotational means comprises a hollow cylinder having a vertical axis, means for rotating said cylinder about said axis, a fixed ring gear encircling said cylinder, a threaded rod extending diametrically across the central opening in said cylinder with one end projecting through the wall thereof, and a pinion gear on said end of the rod and meshing with said ring gear, said movable member being threadedly mounted on said rod.

14. A machine as set forth in claim 13 wherein said means for rotating the cylinder is a motor.

15. A machine for bonding a plurality of metal tabs extending radially outwardly from an integrated circuit device to a substrate having the device positioned thereon, comprising a support for said substrate, a first member pivotal about a first axis, tool-supporting appartus carried by said first member for movement therewith and independently pivotal about a second axis perpendicular to and intersecting said first axis, a bonding tool mounted on said tool-supporting apparatus and disposed on a third axis passing through said members to be bonded and through said intersection of said first and second axes, with the effective bonding end of the tool being positioned at said intersection, said end of the tool being of an open-ended boxlike configuration of a size to fit freely over said integrated circuit device with the ends of the side wall portions thereof adapted to engage said tabs.

16. A machine as set forth in claim 15 wherein the end surface of each side wall portion of said end of the tool is outwardly curved to provide a restricted area of engagement between the tool and the tabs.

17. A machine as set forth in claim 16 and further including operating means connected to said tool-supporting apparatus for moving said end of the tool into successive engagement with said members for performing individual bonding operations at each member throughout a spiral path passing successively through said members a plurality of times whereby each member is bonded to the substrate in a different area upon each such engagement.