SOLID PHOTORESIST COMPRISING A POLYENE AND A POLYTHIOL

• US 3,767,398 A
• Filed: 10/26/1971
• Issued: 10/23/1973
• Est. Priority Date: 10/26/1971
• Status: Expired due to Term

• Current Assignee: W.R. Grace & Co.-Conn. (WR Grace & Company)
• Original Assignee: Charles Robert Morgan
• Inventors: Morgan, Charles Robert
• Primary Examiner(s): Torchin, Norman G.
• Assistant Examiner(s): Suro Pico, Alfonso T.
• Application Number:
  US05/192,251
• Time in Patent Office: 728 Days
• Field of Search: 96/35.1,36.2,115P,115R,88
• US Class Current: 430/314
• CPC Class Codes: C08G 75/045 from mercapto compounds and unsaturated compounds
• CPC Class Codes: C08G 75/12 Polythioether-ethers C08G75/0245 takes precedence
• CPC Class Codes: G03F 7/0275 with dithiol or polysulfide compounds

Abstract

This invention is directed to a solid photoresist composition comprising a polyene, polythiol and photosensitizer admixture which when coated on a substrate to be modified, e.g., ceramic, glass, metal oxide and metal surfaces and exposed imagewise to actinic radiation results in an insoluble cured polythioether photoresist in the exposed segments with the unexposed segments of the composition being removed in suitable solvents to allow etching of the metal thereunder. Optionally, the solid photoresist composition can be covered with a transparent film to insure cleanliness, which film can be removed before or after exposure as desired.

Claims

2. a polythiol containing at least two thiol groups per molecule, the total combined functionality of (a) the reactive unsaturated carbon to carbon bonds per molecule in the polyene and (b) the thiol groups per molecule in the polythiol being greater than four and the weight ratio of the polyene:

polythiol being in the range 1;

0.1-0.8 respectively and

3. The process according to claim 1 wherein the composition is applied to the surface as a coating in solution and the solvent is removed.

4. A process for making a printed circuit board comprising the steps of:

a. applying to the surface of a metal clad printed circuit board a solid photocurable composition consisting essentially of

5. The process according to claim 4 wherein the composition is applied to the surface by lamination.

6. The process according to claim 4 wherein the composition is applied to the surface as a coating in solution and the solvent is removed.

7. A process for plating metal comprising:

a. applying to an etchable metal surface a solid layer of a photocurable composition consisting essentially of;

8. A process according to claim 7 wherein Said plating metal is tin-lead alloy.

9. A process according to claim 7 wherein said plating metal is gold.

10. A process according to claim 7 whereas said etchable metal surface is perforated.

11. The process according to claim 7 wherein the composition is applied to the surface by lamination.

12. The process according to claim 7 wherein the composition is applied to the surface as a coating in solution and the solvent is removed.