ELECTRONIC HYBRID PACKAGE

• US 3,784,725 A
• Filed: 07/24/1972
• Issued: 01/08/1974
• Est. Priority Date: 07/24/1972
• Status: Expired due to Term

• Current Assignee: Carroll R. Perkins, Irwin A. Lucks
• Original Assignee: Carroll R. Perkins, Irwin A. Lucks
• Inventors: Perkins, Carroll R., Lucks, Irwin A.
• Primary Examiner(s): Tomsky, Stephen J.
• Assistant Examiner(s): Weldon, U.
• Application Number:
  US05/274,627
• Time in Patent Office: 533 Days
• Field of Search: 29/627,626 174/52R,52S 58/23BA,23R,88R,88W 317/11R,11B,11C,11CC 179/17R 206/45.34
• US Class Current: 361/728
• CPC Class Codes: G04G 17/02 Component assemblies
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

An electronic package in which semiconductor technology is bonded to a lead-frame and thereafter encapsulated and formed to be functional of its self.

Claims

1. An electronic package comprising:

a preformed lead frame means having interconnects leading therfrom;

electronic means connected to said lead frame, a body surrounding the interconnects of said lead frame means, said body being molded about said interconnects to form a peripheral wall about said frame and thereby support said lead frame with said electronic means within an area formed by said wall, said molded body having atleast one cavity spaced from and under said area for said lead frame, said wall and said cavity having exposed contacts of said interconnects on a surface of said wall and a surface within said cavity;

a power supply means receivable within said cavity, said power supply means being connectable to said exposed contacts of said interconnects from said lead frame such that it may be easily installed and replaced from time to time, said power supply means providing power through said lead frame to said electronic means; and

controllable means bonded to said peripheral wall of said molded body, said controllable means having circuit connections to said contacts on said peripheral wall whereby said controllable means is operable by said electronic means within the area defined by said wall to thereby with said wall and body provide a sealed housing for said electronic means.

2. The structure of claim 1 wherein said molded body has at least two cavities formed at various locations spaced from and under said lead frame to permit installation of an oscillator means as well as said power supply means within the bounds of the peripheral wall of said molded body for control of said electronic means in that said oscillator means in connectable to said lead frame in the cavity therefor by said interconnects.

3. The structure of claim 2 wherein said controllable means is a display means.

4. The structure of claim 3 and further comprising a metal housing surrounding said package permitting visual observation of said display means on one side thereof, said housing having removable portions on the other side thereof permitting access to said power supply means and said oscillator means in the cavities containing same, said housing being otherwise is sealing contact with said molded body to provide a chamber for said display means above said molded body sealed from atmospheric conditions.

5. The structure of claim 4 wherein said metal housing has a transparent portion over said chamer for viewing said display means.