TIN/LEAD PLATING BATH AND METHOD
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Abstract
A PLATING BATH FOR ELECTRODEPOSITION OF TIN/LEAD ALLOYS CONTAINS STANNOUS ION, LEAD ION, A FLUOBORATE, FLUOSILICATE OR SULFAMATE RADICAL AND, AS A BRIGHTENER SYSTEM, A NON IONIC POLYOXALKYLATED SURFACTANT, A LOWER ALIPHATIC ALDEHYDE, AN ALIPHATIC OR AROMATIC AMINE AND AN AROMATIC ALDEHYDE, THE PH OF THE BATH BEING LESS THAN ABOUT 3.0.
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