TEMPERATURE SENSOR

• US 3,789,191 A
• Filed: 09/01/1972
• Issued: 01/29/1974
• Est. Priority Date: 09/01/1972
• Status: Expired due to Term

• Current Assignee: Robert G. Spindler
• Original Assignee: Robert G. Spindler
• Inventors: Spindler, Robert G.
• Primary Examiner(s): Mayewsky, Volodymyr Y.
• Application Number:
  US05/285,779
• Time in Patent Office: 515 Days
• Field of Search: 219/203,494,501,504,522,543,544 338/23,20,21,22,253,270,297,24,301,25 161/183,190,199 73/362
• US Class Current: 338/24
• CPC Class Codes: B32B 17/10174 Coatings of a metallic or dielectric material on a constituent layer of glass or polymer
• CPC Class Codes: H01C 7/04 having negative temperature coefficient thermometers using resistive elements G01K7/16
• CPC Class Codes: Y10T 428/31507 Of polycarbonate

Abstract

A temperature sensor suitable for use in an electrically heated, laminated window is disclosed. The laminated window includes a plastic interlayer material sandwiched between two rigid, transparent sheets, one of which sheets has an electrically conductive coating in contact with the interlayer. Embedded within the plastic interlayer is the temperature sensor which is comprised of a resistance filament encapsulated within a substantially material which has a heat deflection temperature greater than the plastic interlayer. Because the temperature sensor has a casing with a higher heat deflection temperature than the plastic interlayer into which it is embedded, fracture and shorting of the resistance filament against the electrically conductive coating, during the high temperature and high pressure conditions of laminating, are avoided. In a particular embodiment of the invention where the interlayer material is plasticized, a protective layer disposed between the interlayer and casing material to prevent hazing is disclosed.

Claims

2. A temperature sensor as set forth in claim 1, in which the casing material is polycarbonate.

3. A temperature sensor as set forth in claim 1, in which a protective layer is disposed between said casing and said interlayer.

4. A temperature sensor as set forth in claim 3, in which the protective layer is acrylic.

5. A temperature sensor as set forth in claim 3, in which the protective layer comprises an outermost layer of polyurethane and an interlayer of acrylic.

6. A temperature sensor as described in claim 1, in which the casing material is selected from the class consisting of polycarbonate, cast acrylic, polystyrene, polyester, polysulfone and nylon.

7. A temperature sensor as set forth in claim 6, in which the resistance filament is uniformly looped about a polycarbonate card and polycarbonate spacers are positioned around said card to hermetically encapsulate said card within said casing.

8. A temperature sensor as set forth in claim 7 in which the casing material is acrylic.

9. A temperature sensor as set forth in claim 8 in which a polyurethane adhesive is disposed about the acrylic casing.

10. A temperature sensor for use with a transparent, laminated, electrically heated window assembly comprising:

a. a resistance filament having a resistivity that changes with temperature uniformly looped about a polycarbonate card, b. a transparent polycarbonate casing, said card being hermetically encapsulated within said casing, and c. electrical leads extending through said casing and adapted to connect said resistance filament to a control system.

11. A temperature sensor for use with a transparent, laminated, electrically heated window assembly comprising:

a. a resistance filament having a resistivity that changes with temperature uniformly looped about a polycarbonate card, b. a transparent acrylic casing, said card being hermetically encapsulated within said casing, and c. electrical leads extending through said casing and adapted to connect said resistance filament to a control system.

12. A temperature sensor for use with a transparent, laminated, electrically heated window assembly comprising:

a. a resistance filament having a resistivity that changes with temperature, b. a transparent casing of a transparent plastic material which has a heat deflection temperature higher than that of polyvinyl butyral, said filament being hermetically encapsulated within said casing, and c. electrical leads extending through and adapted to connect said resistance filament to a control system.