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CATALYTIC SENSITIZATION OF SUBSTRATES FOR METALLIZATION

  • US 3,798,050 A
  • Filed: 05/28/1971
  • Issued: 03/19/1974
  • Est. Priority Date: 05/28/1971
  • Status: Expired due to Term
First Claim
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2. In the method of coating a non-conductive substrate surface with a metal-containing deposit comprising the steps of:

  • first, contacting the substrate with a solution of tin salt and then rinsing the same;

    second, contacting the substrate with a solution of palladium salt and thereafter contacting the substrate with a solution containing the desired metal to be deposited and reducing agent for such metal, whereby a non-uniform metal-containing deposit is formed, the improvement comprising the steps of;

    rinsing the tin salt contacted substrate with a rinse of water containing an alkaline buffering compound in an effective amount to provide a pH of about 7 to about 9 in the mixture of palladium salt solution and remaining rinse in contact with the substrate whereby a uniform metal-containing deposit results.

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