RECEIVER FOR INDUCTIVE COMMUNICATION SYSTEM

• US 3,809,825 A
• Filed: 04/26/1972
• Issued: 05/07/1974
• Est. Priority Date: 07/23/1969
• Status: Expired due to Term

• Current Assignee: Inductive Technology Incorporated X/O Alvin Edelman
• Original Assignee: Howard A. Schaad, Richard L. Randolph
• Inventors: Schaad, Howard A., Randolph, Richard L.
• Primary Examiner(s): Blakeslee, Ralph D.
• Application Number:
  US05/247,548
• Time in Patent Office: 741 Days
• Field of Search: 179/82 343/787,788 325/28
• US Class Current: 381/79
• CPC Class Codes: H04B 13/02 Transmission systems in which the medium consists of the earth or a large mass of water thereon, e.g. earth telegraphy

Abstract

There is disclosed a receiver apparatus for inductive communication systems. A flat high mu metal, core carrying a multi layer coil has an end on the inside layer connected to the input terminal of a low level integrated circuit amplifier and the coil end on the outside layer is connected to ground terminal of the amplifier.

Claims

1. In an induction communicatiOn system, apparatus for detecting signals in a dynamic magnetic field, comprising a coil, a high permeability core, said core including a thin flat member of a high mu metal and having a width substantially equal to an inside dimension of said coil, a utilization device, said utilization device includes a low level amplifier and a speaker, said speaker being relatively insensitive to said dynamic magnetic field, said coil comprises a plurality of winding layers and wherein the coil end on the inside layer closest to said core is connected to the signal input terminal of said amplifier and the coil end on the outside winding layer is connected to the ground terminal of said amplifier.

2. The invention defined in claim 1 wherein said coil is cylindrical.

3. The invention defined in claim 1 wherein said coil is flat.

4. The invention defined in claim 1 including a printed circuit board having a large planar area of unetched conductive metal thereon to constitute a large land mass on said board and wherein the ground terminal of said integrated circuit amplifier is connected to said large land mass.