MULTI-POINT PROBE HEAD ASSEMBLY

• US 3,832,632 A
• Filed: 11/22/1971
• Issued: 08/27/1974
• Est. Priority Date: 11/22/1971
• Status: Expired due to Term

• Current Assignee: Frank J. Ardezzone
• Original Assignee: Frank J. Ardezzone
• Inventors: Ardezzone, Frank J.
• Primary Examiner(s): Smith, Alfred E.
• Assistant Examiner(s): Karlsen, Ernest F.
• Application Number:
  US05/201,098
• Time in Patent Office: 1,009 Days
• Field of Search: 324/158F,158P,72.5 200/166C
• US Class Current: 324/754.2
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Abstract

A multi-point test probe assembly for interface contact with miniature electronic devices. The assembly comprises a plurality of electrically conductive probes each adapted to be electrically engaged to a conductive lead and each probe having a probe arm extending to a common area with a tip adapted for interface contact with a terminal of a miniature electronic device positioned within said common area. The probe tips may be comprised of a compressible elastic material. A probe support member engages each of the probe arms and tips to support the arms and tips about said common area.

Claims

1. A multi-point test probe head assembly for interface contact with minature electronic devices to be tested, the assembly comprising, in combination:

a platform carrying a wiring harness for electrical interconnection with electronic test instruments;

a rigid probe support member integrally secured to the platform, the support member establishing a rigid planar support wall about a common area; and

a plurality of electrically conductive probes each electrically coupled to said wiring harness, each of the probes having a probe arm extending to said common area and an electrically conductive tip contact secured about the terminus of the arm, said tip contacts being adapted for interface contact with terminals of miniature electronic devices when said devices are positioned adjacent to said common area, said tip contacts each being engaged to said horizontal support wall and arranged in a pattern Format consistent with the pattern format of the terminals of the device to be tested, said tip contacts being further comprised of an elastic, compressible conductive material with granular particles of highly electrically conductive metals suspended in a rubber base material, some of said particles having hard sharp corners;

whereby said particles having sharp corners may penetrate an oxide layer over the terminals of the electronic devices contacted by said tips.

2. The test probe assembly of claim 1 wherein said tip contacts are comprised of a material including silver particles.

3. The test probe assembly of claim 1 wherein said tip contacts are comprised of a material including silver particles and rhodium particles.

4. The test probe assembly of claim 1 wherein said tip contacts are comprised of a material including silver particles and rhodium particles suspended in a rubber base material.

5. The test probe assembly of claim 1 wherein said probe arms are comprised of a film material supported in place by the probe support member and the tips are of a hemispherical shape.

6. A multi-point test probe head assembly for interface contact with miniature electronic devices to be tested, the assembly comprising, in combination:

a platform carrying a wiring harness for electrical interconnection with electronic test instruments;

a rigid probe support member integrally secured to the platform, the support member being of tapered cross-sectional dimensions with the member tapered towards a common area and establishing a planar plateau at said common area for alignment with the contacts of electronic devices to be tested;

a plurality of elongated electrically conductive probes each electrically coupled to said wiring harness and having a probe arm portion of a film of electrically conductive first material, the probe arm portion of each probe being extended to said common area with the terminus end and at least a portion of each of said probe arm portions extending from its terminus end being affixed to the planar surface of said planar support wall of the rigid probe support member to form inflexible electrical current conducting leads, a bead of an electrically conductive second material affixed to and about said terminus end of each of said probe arm portions to form tip contacts within the common area for engaging terminals of a miniature electronic device when said device is positioned adjacent to said common area with said tip contact with the electronic device being tested; and

electrical terminal means adjacent the other terminal end of said probes for interrupting the electrical continuity of said probe and said harness, the terminal means being adapted to receive electronic test circuitry about said platform.