APPARATUS FOR BONDING A BEAM-LEAD DEVICE TO A SUBSTRATE

• US 3,843,036 A
• Filed: 10/04/1973
• Issued: 10/22/1974
• Est. Priority Date: 10/12/1971
• Status: Expired due to Term

• Current Assignee: AT&T Technologies Inc (Nokia Corporation)
• Original Assignee: Fred J. Scheider, Jack J. Monahan
• Inventors: Monahan, Jack J., Scheider, Fred J.
• Primary Examiner(s): Juhasz, Andrew R.
• Assistant Examiner(s): Craig, R. J.
• Application Number:
  US05/403,588
• Time in Patent Office: 383 Days
• Field of Search: 228/4,6,44,47 29/23B 219/78,79
• US Class Current: 228/6.2
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01075 Rhenium [Re]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: Y10T 29/53178 Chip component
• CPC Class Codes: Y10T 29/53261 Means to align and advance work part

Abstract

A beam-lead bonder incorporates an automatically indexable feeder slide for feeding a selected integrated circuit device to a bonding station, and a shuttle table for positioning a particular bond site on a substrate in alignment with the selected device. The alignment can be checked by optical instrumentation and refined by a micromanipulator. Before bonding, the device is transferred to the bonding tip of the bonder, and the substrate is transferred to a bonding support. The feeder slide and the shuttle table retract, permitting the table to be loaded with a substrate for a subsequent bonding operation while bonding of the previously aligned device and substrate is taking place. The bonded substrate disengages from the bonding support after bonding and slides into a receiving tray.

Claims

1. An apparatus for bonding a semiconductor device to a predetermined area of a substrate, which comprises:

a bonding station including, a bonding tip positioned on and movable along a bonding axis, and a bonding support located in normally spaced relation to the bonding tip in alignment with the bonding axis;

means for feeding a semiconductor device into alignment with the bonding axis;

means for locating a substrate with a predetermined area thereof in alignment with the bonding axis;

means for transferring the device from the feeding means to the bonding tip;

means for transferring the substrate from the locating means to the bonding support;

means for positioning the substrate locating means in a preload position away from the bonding station to allow access for loading a substrate for a subsequent bonding operation; and

means for effecting a bond between the semiconductor device and the substrate in alignment with the bonding axis while the locating means is in the preload position.

2. An apparatus as described in claim 1, wherein the means for feeding a semiconductor device comprises:

a slide for supporting an array of a pluralIty of devices, the slide being mounted for movement between a retracted position away from the bonding axis and a forward position with the array in intersection relation with the bonding axis, and indexing means connected to the slide for moving a selected device of the array into alignment with a predetermined portion of the slide which aligns with the bonding axis each time the slide moves into intersecting relation with the bonding axis.

3. An apparatus as described in claim 1, wherein the alignment between the bonding axis, the device fed by the feeding means, and the located substrate are grossly aligned, and wherein the apparatus further comprises means for manipulating the grossly aligned device into precise axial relation with the bonding axis and for precisely adjusting the position of the predetermined area of the substrate with respect to the device transferred to the bonding tip.

4. An apparatus as described in claim 3, further comprising means for disengaging the substrate from the bonding support after bonding, and a tray for retaining the disengaged substrate.

5. An apparatus for compliantly bonding a beam-lead device to a predetermined area on a substrate, which comprises:

a compliant bonding station including a bonding tip positioned on and movable along a bonding axis, a bonding support located in normally spaced relation to the bonding tip, and means for supporting compliant material across the bonding tip;

means for feeding a beam-lead device into alignment with the bonding axis;

means for locating a substrate with a predetermined area thereof in alignment with the bonding axis;

means for transferring the device from the feeding means to the bonding tip;

means for transferring the substrate from the locating means to the bonding support;

means for positioning the substrate locating means in a preload position away from the bonding station to allow access for loading a substrate for a subsequent bonding operation; and

means for effecting a bond between the beam-leads of the device and the substrate in alignment with the bonding axis while the substrate locating means is in the preload position.

6. An apparatus as described in claim 5 wherein the device feeding means comprises:

supply means for supporting an array of beam-lead devices spaced in equal predetermined increments from each other on the array;

means for moving the supply means between a retracted position and a position toward the bonding axis to locate the array in intersecting relation with the bonding tip; and

indexing means for translating the supported array in increments equivalent to the predetermined spacing between the devices to provide gross alignment of successive devices with the bonding axis.

7. An apparatus according to claim 6 further comprising a manipulatable base, and wherein the feeding means and the locating means are mounted on the manipulatable base, and are movable with respect to the bonding tip for precisely orienting the aligned beam lead devices with respect to the bonding tip and for precisely orienting the predetermined area of the substrate with respect to the aligned device after transfer of the device to the bonding tip.

8. A beam-lead bonding apparatus for successively bonding a beam-lead device to a predetermined area on a preloaded substrate and for accepting a substrate for a subsequent bonding operation while bonding of the device to the preloaded substrate is effected, which comprises:

a bonding station including, a bonding tip movable axially along a bonding axis, and a bonding support located in normally spaced relation from the bonding tip along the bonding axis;

means for feeding an array of beam-lead devices into and out of intersecting relation with the bonding axis;

means for indexing the array to provide alignment between a preselected device of the array and the bonding tip when the array is in intersecting relation with the bonding axis;

a substrate supPort slidably mounted for moving into intersecting relation with the bonding axis, and out of intersecting relation with the bonding axis into a preload position for accepting a substrate;

substrate locator means mounted to the substrate support for positioning a predetermined area of a substrate coincident with a predetermined portion of the substrate support which aligns with the bonding axis when the substrate support has moved into intersecting relation with the bonding axis;

means for transferring the substrate from the substrate support to the bonding support; and

timed actuating means for effecting a bond between the selected device and the substrate when the feeding means is out of intersecting relation with the bonding axis, and the substrate support is in the preload position for accepting a substrate for a successive bonding operation.

9. A beam-lead bonding apparatus as described in claim 8 wherein the bonding support has an opening in alignment with the bonding axis, facing the bonding tip, wherein the bonding support is movably mounted to advance along the bonding axis toward the substrate when the substrate is in alignment with the bonding axis, and wherein means for transferring the substrate from the substrate support to the bonding support comprises:

an actuator means connected to the movable bonding support for moving the bonding support toward and past the location of the substrate on the substrate support to lift the substrate from the substrate support; and

vacuum suction means acting through the opening in the bonding support for engaging the axially aligned area of the substrate, to support the substrate in fixed relation to the bonding axis for bonding.

10. A beam-lead bonding apparatus as described in claim 9, wherein the actuator means reverses its movement for lowering the bonding support and the substrate after bonding, the bonder further comprising, a projecting member mounted in the path of the substrate being lowered to contact the substrate and disengage it from the bonding support, and a receiving tray for collecting the substrate after disengagement from the bonding support.

11. A beam-lead bonding apparatus as described in claim 9, wherein substrate locator means comprise a pair of orthogonal reference edges mounted on the substrate support for locating the substrate on the substrate support with respect to the location of reference stops, further comprising means for quickly altering the reference edges with respect to the reference stops to locate the substrate in an altered position with respect to the reference stops.

12. A beam-lead bonding apparatus for bonding a first selected beam-lead device to a first predetermined bond site of a substrate and for bonding a second beam-lead device to a second predetermined area of the substrate, which comprises:

a bonding station including, a bonding tip movable along a bonding axis, and a bonding support located in normally spaced relation with the bonding tip in alignment with the bonding axis;

means for selecting a first and a second beam-lead device in succession;

means, responsive to the selection of one of the beam-lead devices, for feeding the selected device into alignment with the bonding axis adjacent to the bonding tip;

substrate feeding means for moving into and out of intersecting relation with the bonding axis and for feeding a substrate, located with respect to the substrate feeding means, into intersecting relation with the bonding axis, adjacent to the bonding support;

means, attached to the substrate feeding means, having locator edges in a first predetermined position for aligning a first predetermined bond site of the substrate with the bonding axis when the substrate feeding means is in intersecting relation with the bonding axis and a first device is fed into alignment with the bonding axis;

means for altering the first predetermined position of the locator edges to a second predetermined position to locate tHe substrate with respect to the altered locator edges for feeding a second predetermined bond site of the substrate into alignment with the bonding axis in response to movement of the substrate feeding means into intersecting relation with the bonding axis when the device feeding means is feeding a second device into alignment with the bonding axis; and

means for effecting bonding of each aligned device to the bond site in alignment with the device along the bonding axis.

13. An apparatus for bonding a device selected from an array of similar devices to a predetermined bond site of a substrate having at least two bond sites, which comprises:

a bonding station including, a bonding tip movable along a bonding axis, and a bonding support located in normally spaced relation to the bonding tip in alignment with the bonding axis;

means for feeding the array of similar devices into and out of intersecting relation with the bonding axis;

means for indexing the array to align a selected device with the bonding tip at the bonding axis;

a substrate locating means movable between a preload position away from the bonding axis and a forward position toward the bonding axis for locating a predetermined bond site of the substrate in axial alignment with the bonding axis when the substrate locating means is in the forward position;

means for transferring the device from the feeding means to the bonding tip;

means for transferring the substrate from the locating means to the bonding support;

means for moving the substrate locating means to retract the substrate locating means to the preload position after transfer of the substrate to the bonding support; and

timing means for actuating the bonding station to bond the device to the bond site of the substrate when the array is out of intersecting relation with the bonding axis and the substrate locating means is in the preload position to accept a substrate for a subsequent bonding operation.