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METHOD OF MAKING AN ENCAPSULATED ASSEMBLY

  • US 3,845,552 A
  • Filed: 04/23/1973
  • Issued: 11/05/1974
  • Est. Priority Date: 03/02/1972
  • Status: Expired due to Term
First Claim
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1. A method of making encapsulated electronic components comprising the steps of:

  • selecting an electronic component including a central body of given, uniform cross-sectional size and shape and a pair of lead wires respectively extending axially from the opposite ends of said body;

    selecting interconnecting wire members having a cross-sectional size and shape closely corresponding to the cross-sectional size and shape of said central body;

    joining a said interconnecting wire member substantially end-to-end with each of said lead wires closely adjacent the central body corresponding respectively therewith to produce a serially connected assembly of substantially uniform, cross-sectional size and shape;

    temporarily locating said assembly in an encapsulation die having a central body portion of substantially uniform internal corss-section; and

    , during the residence of said assembly in said die, forming a quantity of encapsulating material of substantially uniform thickness over the exterior of said assembly in intimate contact therewith, whereby to provide an encapsulated electronic unit of substantially uniform cross-sectional size throughout its length.

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