Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier

• US 3,868,724 A
• Filed: 11/21/1973
• Issued: 02/25/1975
• Est. Priority Date: 11/21/1973
• Status: Expired due to Term

• Current Assignee: Frank A. Perrino
• Original Assignee: Frank A. Perrino
• Inventors: Perrino, Frank A.
• Primary Examiner(s): James, Andrew J.
• Application Number:
  US05/417,999
• Time in Patent Office: 461 Days
• Field of Search: 317/234,4,4.1,5,5.4 174/525
• US Class Current: 257/668
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/81193 wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/49572 consisting of thin flexible metallic tape with or without a film carrier H01L23/49503 - H01L23/49568 and H01L23/49575 - H01L23/49579 take precedence
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 23/5384 Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors H01L23/5383, H01L23/5385 take precedence; pins attached to insulating substrates H01L23/49811
• CPC Class Codes: H01L 24/50 Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto thin flexible metallic tape with or without a film carrier H01L23/49572, flexible insulating substrates H01L23/4985, H01L23/5387
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/86 using tape automated bonding [TAB]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/0105 Tin [Sn]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15173 : in a single layer of the multilayer substrate
• CPC Class Codes: H05K 1/0393 : Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/112 : directly combined with via connections
• CPC Class Codes: H05K 2201/0355 : Metal foils
• CPC Class Codes: H05K 2201/0394 : Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
• CPC Class Codes: H05K 2201/09472 : Recessed pad for surface mounting recess in pad H05K2201/09745; Recessed electrode of component
• CPC Class Codes: H05K 2201/10674 : Flip chip
• CPC Class Codes: H05K 2203/063 : of preperforated insulating layer

Abstract

Connecting structures for integrated circuit chips or dice are fabricated by forming a plurality of sets of leads on a first surface of a flexible tape. The sets of leads penetrate through to the second surface of the tape at ends of the leads, via holes formed in the tape. Small contacts are formed to extend beyond the second surface of the tape at the points where the leads penetrate through the tape. The contacts formed at a first end of each of the leads are arranged in a pattern which aligns with corresponding contacts on the integrated circuit chip. The chips are then bonded to the contacts formed at the first ends of the leads, and the chips are subsequently enclosed by a suitable encapsulant such as epoxy. The contacts formed at second ends of the leads are arranged in a pattern which is larger than the pattern of contacts at the first end of the leads, and are disposed for connection to external circuitry.

Claims

1. A connecting structure for semiconductor devices, which comprises:

a. a tape of insulating material having a plurality of holes formed in a predetermined pattern;

b. electrical conductors formed on a first surface of said tape, wherein portions of said conductors cover one or more of said holes thereby to expose said portions of said conductors through said holes; and

c. electrical contacts formed through said holes in ohmic contact with said portions of said conductors such that electrical connection can be made to said conductors, by means of said contacts, from an object adjacent the second surface of said tape, and said semiconductor devices are electrically insulated from said electrical conductors by said tape in all areas except adjacent said electrical contacts.

2. Structure which comprises:

a. a semiconductor die containing a plurality of contacts shaped on one surface thereof;

b. an insulating tape over said one surface of said semiconductor die, said insulating tape possessing a plurality of holes, each hole being located directly above a corresponding one of said contacts; and

c. a plurality of electrical leads electrically connected on a one-for-one basis to said plurality of contacts, said electrical leads being formed on and adherent to said tape, each lead being in registery with, and overlying a corresponding hole, and an end portion of each lead having a section of conductive material attached thereto and extending through said hole into electrical contact with said corresponding contact on said die, wherein said semiconductor die is electrically insulated from said electrical leads by said insulating tape in all areas except adjacent said contacts.

3. Structure as in claim 2 wherein said insulating tape is not adherent to said top surface of said semiconductor chip but is held in contact therewith by the sections of electrically conductive material interconnecting the end portions of said conductive leads with said contacts.

4. Structure as in claim 3 wherein said conductive leads are formed on, and adherent to said conductive tape.

5. Structure as in claim 2 including package means containing a bottom part and a top part, said semiconductor die being bonded to an adherent portion of said bottom part, said top part being bonded to said bottom part so as to completely surround said semiconductor die thereby to form a closed container within which said chip is contained.

6. Structure as in claim 5 wherein said bottom and said top part of said package comprise epoxy.