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Multiple magnetic alignment of semiconductor devices for bonding

  • US 3,868,764 A
  • Filed: 11/09/1973
  • Issued: 03/04/1975
  • Est. Priority Date: 11/09/1973
  • Status: Expired due to Term
First Claim
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1. A self-aligning method of automatically transferring integrally leaded semiconductor device chips to a conductive lead frame structure for permanently bonding thereto, said method comprising:

  • placing a semiconductor device chip having a face with a plurality of soft ferromagnetic integral leads thereon into a recess in one surface of a template so that said chip face is oriented upwardly, said recess having a bottom portion substantially parallel to said one template surface, said template having a core of soft ferromagnetic material extending from said recess bottom portion to an opposite surface of the template;

    positioning a conductive lead frame structure having a soft ferromagnetic convergent cantilevered finger set over said template so that said fingers are spaced above in closely spaced relation with the chip in the template recess;

    applying a magnetic force generally perpendicular to the underside of said core to precisely align said integral chip leads with corresponding fIngers of said lead frame and to concurrently magnetically raise the chip from the template recess up to said fingers to produce a precisely aligned engagement between all of the integral chip leads and their corresponding fingers; and

    bonding said integral chip leads to said lead frame fingers while the magnetic force is still applied.

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