×

Encapsulating compound and closure

  • US 3,879,575 A
  • Filed: 02/21/1974
  • Issued: 04/22/1975
  • Est. Priority Date: 02/21/1974
  • Status: Expired due to Term
First Claim
Patent Images

1. In combination:

  • a plurality of insulated conductor splice points enveloped in a waterproof encapsulating agent comprising from 84.5 to 92.5 parts by weight of mineral oil, from 0.5 to 3.0 parts by weight styrene-isoprene-styrene block copolymer, and from 6.0 to 13.0 parts by weight of polyethylene having a weight average molecular weight above 2000.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×