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Method of manufacturing a bonded electrical contact for thermoelectric semiconductor element

  • US 3,879,838 A
  • Filed: 07/08/1971
  • Issued: 04/29/1975
  • Est. Priority Date: 03/30/1967
  • Status: Expired due to Term
First Claim
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1. A METHOD OF BONDING A THERMOELECTRIC MATERIAL TO AN ELECTRICAL SHOE TO FORM A THERMOELECTRIC ARTICLE WHICH COMPRISES:

  • PROVIDING UPON A SURFACE OF SAID SHOE A THIN ADHERENT LAYER OF A DIFFUSION BARRIER METAL SELECTED FROM THE CLASS CONSISTING OF IRON, TUNGSTEN, MOLYBDENUM, AND NIOBIUM, AND DIFFUSION BONDING A SURFACE OF SAID BARRIER METAL TO A SURFACE OF SAID THERMOELECTRIC MATERIAL AT A COORDINATED ELEVATED TEMPERATURE AND PRESSURE TO FORM SAID THERMOELECTRIC ARTICLE.

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