Electronic module and method of fabricating same

• US 3,889,365 A
• Filed: 08/15/1973
• Issued: 06/17/1975
• Est. Priority Date: 08/09/1971
• Status: Expired due to Term

• Current Assignee: Gordon L. Brock
• Original Assignee: Gordon L. Brock
• Inventors: Brock, Gordon L.
• Primary Examiner(s): Lanham, C. W.
• Assistant Examiner(s): Walkowski, Joseph A.
• Application Number:
  US05/388,444
• Time in Patent Office: 671 Days
• Field of Search: 29/626,627,592 174/52PE,59,50.52,50.53,50.54,50.57 317/11R,11C,11CM,11CP,11F 200/51R 264/272
• US Class Current: 29/856
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 7/005 arrangements of circuit components without supporting structure
• CPC Class Codes: Y10T 29/4914 with deforming of lead or terminal
• CPC Class Codes: Y10T 29/49172 by molding of insulating material
• CPC Class Codes: Y10T 29/49218 with deforming

Abstract

An electronic module and method of fabrication thereof whereby highly durable and low cost modules are obtained. The leads of the electronic components, such as resistors, transistors, and the like, are cut and bent in a pre-determined manner and the component inserted in openings in an assembly board so that the leads cross at positions where solder connections are to be made. After soldering the components together at the appropriate places and, depending on the circuit, soldering in insulated circuit cross-overs and lead wires, if the component leads are too short for such use, the circuit is removed from the assembly board, rolled into a generally cylindrical shape and the leads thereof inserted into the appropriate pins of a standard electron tube type plug. Thereafter the leads are dipped soldered to the plug pins, an extruded plastic member is snapped over the edge of the plug, and the circuit potted in epoxy within the extruded member to complete the module.

Claims

1. A METHOD OF PACKAGING AN ELECTRONIC CIRCUIT HAVING A PLURALITY OF ELECTRONIC COMPONENTS COMPRISING:

A. FABRICATING A REUSEABLE BOARD WITH A PLURALITY OF MEANS FOR RECEIVING AND RESTRAINING SAID COMPONENTS IN A PREDETERMINED RELATIVE DISPOSITION;

B. CUTTING AND BENDING THE LEADS OF SAID COMPONENTS AND DISPOSING SAID COMPONENTS IN THEIR RESPECTIVE POSITIONS ON SAID BOARD SO THAT SAID LEADS ARE DISPOSED ADJACENT EACH OTHER AT POINTS WHERE CIRCUIT CONNECTIONS ARE TO BE MADE, AND ARE DISPOSED TO FORM CIRCUIT LEADS PROJECTING IN A FIRST DIRECTION FROM SAID CIRCUIT;

C. JOINING SAID LEADS WHERE SAID LEADS ARE ADJACENT EACH OTHER TO FORM SAID CIRCUIT CONNECTIONS AND TO PROVIDE A SELF SUPPORTING CIRCUIT STRUCTURE;

D. REMOVING SAID CIRCUIT AND CIRCUIT LEADS FROM SAID BOARD AND COILING SAID CIRCUIT ABOUT AN AXIS PARALLEL TO SAID FIRST DIRECTION;

E. CONNECTING SAID CIRCUIT LEADS TO A CONNECTOR;

F. PROVIDING AN OPEN-ENDED COVER OVER SAID CIRCUIT MATING WITH SAID CONNECTOR;

AND G. POTTING SAID CIRCUIT BY POURING A POTTING COMPOUND INTO SAID OPEN-ENDED COVER.

2. The method of claim 1 further including the additional step of soldering additional wires into said circuit to extend said leads of said components where said leads of said components are too shorT to reach said circuit connections or to form said circuit leads.

3. The method of claim 1 wherein said electronic components further include at least one component which is mechanically adjustable, said adjustable component being connected to said circuit so as to be adjustable from a second direction opposite said first direction, and said potting compound is poured into said open-ended cover to a depth to retain said adjustable component without interfering with the adjustability thereof.

4. A method of packaging an electronic cirucit having a plurality of electronic components comprising the steps of :

a. fabricating a board with a plurality of means for receiving and restraining said components in a predetermined relative disposition;

b. cutting and bending the leads of said components and disposing said components in their respective positions on said board so that siad leads are disposed adjacent each other at points where circuit connections are to be made and are disposed to form circuit leads projecting ain a first direction from said circuit;

c. soldering said leads where said leads are adjacent each other to form said circuit connections and to provide a self supporting circuit structure;

d. removing said circuit and circuit leads from said board and coiling said circuit about an axis parallel to said first direction and through an angle approaching 360'"'"''"'"' so that the opposite sides of said circuit structure are approximately adjacent each other;

e. connecting said circuit leads to a connector plug of the type having a generally circular molded base with a plurality of hollow connector pins disposed in a circle and a retaining ring groove molded therein, by inserting said circuit leads into selected ones of said hollow pins and soldering them thereunto;

f. slipping a tubular cover overe said circuit and causing said cover to snap into groove in said plug; and

g. potting said circuit by pouring a potting compound into the open end of a said cover.