Method of depositing a metal on a surface of a substrate

• US 3,900,614 A
• Filed: 08/16/1973
• Issued: 08/19/1975
• Est. Priority Date: 11/26/1971
• Status: Expired due to Term

• Current Assignee: AT&T Technologies Inc (Nokia Corporation)
• Original Assignee: David Jacob Lando
• Inventors: Lando, David Jacob
• Primary Examiner(s): Welsh, John D.
• Application Number:
  US05/388,842
• Time in Patent Office: 733 Days
• Field of Search: 117/212,13E 106/1
• US Class Current: 427/258
• CPC Class Codes: C23C 18/1608 from pretreatment step, i.e. selective pre-treatment
• CPC Class Codes: C23C 18/30 Activating or accelerating or sensitising with palladium or other noble metal
• CPC Class Codes: H05K 3/182 characterised by the patterning method

Abstract

A method of depositing a metal on a surface of a substrate is disclosed. A suitable colloidal sensitizing solution, comprising insoluble hydrous oxide particles, selected from among solutions revealed in application Ser. No. 8,022, filed Feb. 2, 1970, is applied to a surface of a substrate. The sensitized substrate surface is then treated with a suitable redox agent to delineate a pattern capable of reducing an activating metal ion to an activating metal. Alternatively, a positive colloidal sensitizing solution, i.e., a solution comprising ions capable of reducing an activating metal ion to an activating metal is applied to the surface and the sensitized surface is then treated with an activating metal ion containing solution to deposit an activating metal pattern thereon. Alternatively, a colloidal activating metal solution is applied to the surface and the surface is then treated with a solution comprising an ion capable of reducing an activating metal ion to deposit an activating metal pattern thereon.

Claims

1. A METHOD OF DEPOSITING A METAL PATTERN ON A SURFACE OF A SUBSTRATE, WHICH COMPRISES:

A, COATING THE SURFACE WITH A SOLUTION COMPRISING AN ACTIVATING METAL ION, AND B. IMPRESSING SAID COATED SURFACE WITH A WETTING SOL, COMPRISING AN INSOLUBLE HYDROUS OXIDE OF AN ELEMENT SELECTED FROM THE GROUP CONSISTING OF SN, PB, TI, V, CR, FE AND BI, SAID HYDROUS OXIDE BEING CAPABLE OF REDUCING SAID ACTIVATING METAL ION TO AN ACTIVATING METAL TO DELINEATE A PATTERN CORRESPONDING TO THE DESIRED METALLIC PATTERN AND DEPOSIT SAID ACTIVATING METAL ON SAID DELINEATED PATTERN.

2. THE METHOD AS DEFINED IN CLAIM 1 WHICH FURTHER COMPRISES TREATING SAID ACTIVATING METAL-DEPOSITED PATTERN WITH AN ELECTROLESS METAL PLATING SOLUTION TO DEPOSIT AN ELECTROLESS