Encapsulated integrated circuit and method

• US 3,909,838 A
• Filed: 08/01/1973
• Issued: 09/30/1975
• Est. Priority Date: 08/01/1973
• Status: Expired due to Term

• Current Assignee: Fritz W. Beyerlein
• Original Assignee: Fritz W. Beyerlein
• Inventors: Beyerlein, Fritz W.
• Primary Examiner(s): Lynch, Michael J.
• Assistant Examiner(s): Wojciechowicz, E.
• Application Number:
  US05/384,629
• Time in Patent Office: 790 Days
• Field of Search: 317/234,5.4,3 357/70,72
• US Class Current: 257/672
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49572 consisting of thin flexible metallic tape with or without a film carrier H01L23/49503 - H01L23/49568 and H01L23/49575 - H01L23/49579 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.

Abstract

An encapsulated integrated circuit having a lead frame comprising a plurality of spaced leads extending outwardly from an inner region. A semiconductor chip is secured to the leads in the inner region. First and second parts formed of an insulating material are disposed on opposite sides of the leads. An adhesive is utilized for binding the first and second parts together with the lead frame to form a unitary assembly which encloses the semiconductor body.

Claims

1. In an encapsulated integrated circuit, a semiconductor body having an integrated circuit formed therein with a plurality of leads connected to the integrated circuit, said leads extending outwardly from the semiconductor body, a body of insulating material encapsulating said semiconductor body and the inner extremities of said leads, an additional lead frame having a plurality of spaced leads with inner and outer extremities, means forming a bond between the inner extremities of the leads of the additional lead frame and the outer extremities of the leads of the first named lead frame, first and second pre-formed parts of a plastic insulating material disposed on opposite sides of the additional leads and means bonding together said first and second parts to provide a unitary assembly enclosing said semiconductor body and the inner extremities of the leads of the additional lead frame.

2. An encapsulated integrated circuit as in claim 1 wherein said means bonding together said first and second parts is in the form of an adhesive.

3. An encapsulated integrated circuit as in claim 1 wherein said first and second parts are provided with cooperative mating means for establishing registration between the parts when they are secured to the leads of the additional lead frame.

4. An encapsulated integrated circuit as in claim 3 wherein said additional lead frame is provided with means cooperating with said cooperative mating means of said parts.

5. An encapsulated integrated circuit as in claim 4 wherein said cooperative mating means includes a pair of spaced pins and wherein said additional lead frame includes means for receiving said pins and for establishing registration between said parts and said additional lead frame.

6. An encapsulated integrated circuit as in claim 1 wherein said body of insulating material is pill-like in form and wherein said parts are provided with recesses adapted to receive said pill-like body.

7. An encapsulated integrated circuit as in claim 6 together with material disposed in said recess so there is substantially no space between said pill-like body and said first and second parts to provide relatively good heat conductivity away from the pill-like body.

8. In a method for fabricating an encapsulated integrated circuit, providing a semiconductor body having a integrated circuit formed therein, securing the inner extremities of a plurality of spaced leads to said semiconductor body, forming a body of insulating material about said semiconductor body and the inner extremities of said leads, securing the inner extremities of a plurality of additional leads to the outer extremities of said first named leads, forming first and second pre-formed parts of plastic insulating material, placing first and second pre-formed parts on opposite sides of the body of insulating material and fastening together said first and second pre-formed parts to bond the same into a unitary assembly enclosing said body of insulating material and the inner extremities of the additional leads.

9. A method as in claim 8 together with the step of forming cooperative mating means in said pre-formed first and second parts so that they will be in registration with each other when the parts are assembled on opposite sides of the body Of insulating material.

10. A method as in claim 9 together with the step of forming registration means in the additional leads which are adapted to mate with the cooperative mating means carried by the pre-formed first and second parts.