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Semiconductor rectifier arrangement

  • US 3,918,084 A
  • Filed: 11/19/1974
  • Issued: 11/04/1975
  • Est. Priority Date: 07/25/1973
  • Status: Expired due to Term
First Claim
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1. A SEMICONDUCTOR RECTIFIER ARRANGEMENT COMPRISING IN COMBINATION:

  • TWO SEMICONDUCTOR RECTIFIER WAFERS, AT LEAST ONE EF WHICH IS A CONTROLLABLE RECTIFIER, A COOLING ELEMENT WHICH IS PROVIDED WITH A COOLING CHANNEL FOR THE PASSAGE OF A LIQUID COOLANT AND ON WHICH SAID RECTIFIER ARE MOUNTED, SAID COOLING ELEMENT BEING FORMED OF TWO COMPONENTS WITH ONE OF SAID COMPONENTS BEING A FLAT METAL BASE BODY AND THE OTHER OF SAID COMPONENTS BEING A FLAT COVER OF AN INSULATING MATERIAL WITH GOOD THERMAL CONDUCTIVITY WHICH IS FASTENED TO THE UPPER SURFACE OF SAID BASE BODY, ONE OF SAID COMPONENTS BEING PROVIDED, IN THE SURFACE THEREOF WHICH ABUTTS THE OTHER OF SAID COMPONENTS, WITH A RECESS WHICH TOGETHER WITH THE ADJACENT SURFACE OF SAID OTHER COMPONENT FORMS SAID COOLING CHANNEL, MEANS FORMED IN SAID BASE BODY AND COMMUNICATING WITH SAID COOLING CHANNEL, A INTERMEDIATE METAL LAYER, WHICH IS SUBDICOOLING CHANNEL, AN INTERMEDIATE METAL LAYER, WHICH IS SUBDIVIDED INTO A PLURALITY OF LAYER PORTIONS, COVERING AT LEAST ONE AREAL SECTION OF THE UPPER SURFACE OF SAID COVER WHICH IS PROVIDED AT A SMALL DISTANCE FROM AND OVERALIES SAID COOLING CHANNEL, EACH OF SAID RECTIFIER WAFERS BEING MOUNTED ON AND HAVING ONE CONTACT SURFACE THEREOF PERMANENTLY ELECTRICALLY CONNECTED TO ONE OF SAID LAYER PORTIONS AND HAVING ITS OPPOSITE UPPER CONTACT SURFACE ELECTRICALLY CONNECTED TO A CONDUCTOR WHICH IS DISPOSED ON AN ADJACENT ONE OF SAID LAYER PORTIONS, AND A MASS OF AN INSULATING MATERIAL INCAPSULATING SAID CONDUCTORS, SAID RECTIFIER WAFERS AND SAID COOLING ELEMENT.

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