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Improved liquid cooled semiconductor disk arrangement

  • US 3,921,201 A
  • Filed: 07/15/1974
  • Issued: 11/18/1975
  • Est. Priority Date: 01/22/1972
  • Status: Expired due to Term
First Claim
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1. A semiconductor arrangement, comprising:

  • a plurality of semiconductor discs, each having ends forming contacts, disposed in a spaced-apart adjacent relationship;

    a plurality of electrically conductive plates, disposed in space-apart parallel relationship in engagement with said discs and between which said discs are arranged, at least a pair of said plurality of semiconductor discs being disposed between said plates in an axially superimposed relationship;

    a plurality of coil springs, disposed between said axially superimposed discs, for pressing said discs into engagement with said plates; and

    means, coupled to said plates, and including side walls interposed therebetween, for conducting a liquid coolant between said plates around said semiconductor discs.

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