Method and apparatus for selective burnout trimming of integrated circuit units

• US 3,930,304 A
• Filed: 11/15/1973
• Issued: 01/06/1976
• Est. Priority Date: 11/18/1972
• Status: Expired due to Term

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Seiler, Hartmut, Keller, Helmut
• Primary Examiner(s): Tupman, W.
• Application Number:
  US05/416,216
• Time in Patent Office: 782 Days
• Field of Search: 29/574, 29/577, 29/577 IC, 29/584, 29/585, 29/586, 338/195
• US Class Current: 438/6
• CPC Class Codes: C08L 2666/08 Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
• CPC Class Codes: C08L 33/00 Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 69/00 Compositions of polycarbonates; Compositions of derivatives of polycarbonates
• CPC Class Codes: H01L 27/00 Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate details thereof H01L23/00, H01L29/00 - H10K10/00; assemblies consisting of a plurality of individual solid state devices H01L25/00
• CPC Class Codes: H01L 27/0802 Resistors only
• CPC Class Codes: Y10S 148/02 Contacts, special
• CPC Class Codes: Y10S 148/055 Fuse

Abstract

Supplementary metallized connection parts short-circuiting or connecting incremental sub-components of one or more circuit elements of an integrated circuit are laid down on the semiconductor slice at the same time as the usual metallized connection pattern is made. The components associated with the incremental sub-components are measured to determine the program of adjustment and selective burnout of the supplementary connections. The selective burnout is carried out by applying a sequence of pulses to the segments to be burned out under monitoring by a measuring circuit, which blocks the delivery of further pulses, either immediately or after one or a few more pulses, when the measuring circuit detects the opening of the connection. The process is preferably carried out on integrated circuits before the semiconductor slice on which they are made is separated into individual circuit units. The pulses are applied in sequences in which individual pulses or series of pulses have increasing amplitude and/or pulse duration and/or pulse frequency.

Claims

1. A method of burning out a selected conductive connection of an integrated circuit unit having a metallic connection pattern, comprising the step of:

applying a plurality of individual pulses of electrical energy in rapid succession to a selected portion of said metallic connection pattern constituting a selected conductive connection to be burned out, in such a way as to deliver to said selected connection amounts of energy per unit of time that increase with time until said connection is burned out.

2. A method according to claim 1, in which the step of applying pulses of electrical energy is carried out by applying successive series of several individual pulses of constant pulse duration and frequency and of amplitude such that the pulse amplitude is increased after the termination of each series of several individual pulses.

3. A method according to claim 1, in which the step of applying pulses of electrical energy is carried out by applying a series of electrical pulses of constant pulse duration and frequency but of pulse amplitude increasing from pulse to pulse.

4. A method according to claim 1, in which the step of applying pulses of electrical energy is carried out by applying successive series of several individual pulses of constant pulse amplitude and frequency, with the pulse duration such that the pulse duration is increased after the termination of each series of several individual pulses.

5. A method according to claim 1, in which the step of applying pulses of electrical energy is carried out by applying a series of electrical pulses of constant pulse amplitude and frequency but of pulse duration increasing from pulse to pulse.

6. A method according to claim 1, in which the step of applying pulses of electrical energy is carried out by applying a series of several individual pulses of constant pulse amplitude and duration, but of increasing pulse frequency.

7. A method according to claim 1, in which the step of applying pulses of electrical energy is carried out by applying a series of pulses in which at least two of the characteristics of pulse amplitude, pulse duration and pulse frequency are increased with the progress of time.

8. A method according to claim 1, in which the step of applying pulses of electrical energy is carried out while superimposing a constant direct current (I₁) upon the applied pulses of electrical energy.

9. A method according to claim 1, in which the step of applying pulses of electrical energy is continued for the application of several supplementary pulses after said connection is interrupted by burnout.

10. A method according to claim 1, operated repeatedly for burning out a succession of selected conductive connections of an integrated circuit, in which the step of applying pulses of electrical energy is in each case carried out by applying a succession of pulses of which the first has an energy content of a predetermined value selected to be not greater than the energy content barely capable of burning out the most easily burned out one of the selected conductive connections to be burned out.

11. A method according to claim 1, operated repeatedly for burning out a succession of selected conductive connections of an integrated circuit, in which the step of applying pulses of electrical energy is in each case carried out by applying a succession of pulses of which the first has an energy content of a predetermined value selected to be less than the energy content necessary to burn out at once the most easily burned out connection of said selected conductive connections to be burned out.

12. A method of providing an electrical resistance of a magnitude within a predetermined resistance range in an integrated circuit unit, comprising the steps of:

providing in said integrated circuit a plurality of parallel resistance paths connected together by metallic connection paths which are part of the metallic connection path pattern of the integrated circuit unit;

burning out a portion of one of said metallic connection paths so as to disconnect at least one of said parallel resistances by applying to said metallic path portion a plurality of individual pulses of electrical energy in rapid succession in such a way as to deliver increasing amounts of energy per units of time until said path is interrupted by burn-out;

measuring the effective resistance of said remaining parallel resistance paths after disconnection as aforesaid, and repeating the burnout disconnecting step and the measuring step until the effective resistance of the remaining parallel resistance paths is within said predetermined range.

13. A method according to claim 12, in which the step of applying pulses of electrical energy to a connection path is carried out with the simultaneous application of a superimposed direct current to said connection path and in which such superimposed direct current (I₁) is utilized for measuring the effective resistance of the remaining parallel combination of resistances.

14. A method according to claim 12, in which each step of applying pulses of electric energy as aforesaid is followed by the application of at least one further pulse of electric energy of the same succession of pulses after the path to which the pulses were being applied has been interrupted by burnout.