Catalyst for electroless deposition of metals
First Claim
1. A method for the decomposition of a metal into an inert substrate from a bath containing said metal, said metal comprising the steps of:
- applying to said substrate a thin film of a thermally decomposable complex of palladium or platimum having the formulaeLmPdXn orLmPtXn whereinL is a ligand or an unsaturated organic group;
Pd or Pt is palladium or platinum metal;
X is a halide, an alkyl group or a bidentate ligand; and
m is from 1 to 4 and n is from 0 to 3;
exposing said substrate to which said complex has been applied to heat at a temperature of about 300°
C and less to effect decomposition of said complex and to create a residue catalytic to a metal in an electroless bath solution; and
depositing a metal from said electroless bath on said substrate in an area rendered catalytic by decomposition of said complex.
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Abstract
A solvent method for the metallization of a non-conductive surface with gold, nickel or copper is shown whereby on a substrate a thermosensitive coordination complex of palladium is deposited; the complex has the formula LmPdXn wherein L is a ligand or unsaturated organic radical, X is a halide, alkyl group or a bidentate ligand and m is an integer from 1 to 4 and n is from 0 to 3; trimethyl phosphite palladium dichloride complex is an appropriate illustration of the complex; the palladium complex is applied on the substrate in a suitable non-aqueous solution such as tetrahydrofuran solution; the complex is then baked in air at elevated temperature; the exposure to high temperature decomposes the complex leaving a residue which is catalytic to the deposition of gold, nickel, cobalt or copper from an electroless bath thereof; the non-conductive material is then immersed in an electroless bath to metallize the areas which have been rendered catalytic; the preferred thermosensitive coordination complex of palladium is trimethyl phosphite palladium dichloride; a requirement for a proper thermal exposure of the complex is that the substrate is capable of withstanding the elevated temperatures such as above 210°C; illustrative organic substrates are polyimides, polysulfones, silicones, vulcanizates, fluoroplastics, polyphenylene sulfides, polyparabanic acids, and polyhydantoin, etc.
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Citations
20 Claims
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1. A method for the decomposition of a metal into an inert substrate from a bath containing said metal, said metal comprising the steps of:
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applying to said substrate a thin film of a thermally decomposable complex of palladium or platimum having the formulae LmPdXn or LmPtXn wherein L is a ligand or an unsaturated organic group;
Pd or Pt is palladium or platinum metal;
X is a halide, an alkyl group or a bidentate ligand; and
m is from 1 to 4 and n is from 0 to 3;exposing said substrate to which said complex has been applied to heat at a temperature of about 300°
C and less to effect decomposition of said complex and to create a residue catalytic to a metal in an electroless bath solution; anddepositing a metal from said electroless bath on said substrate in an area rendered catalytic by decomposition of said complex. - View Dependent Claims (2, 3, 4)
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5. A method for the metallization of a non-conductive substrate with nickel, cobalt, gold or copper comprising the steps of:
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a. applying to said substrate a thermally sensitive, coordination complex of palladium or platinum having the formula LmPdXn or LmPtXm b. forming residue catalytic to electroless nickel, cobalt, gold or copper on said substrate by decomposing the said complex at a temperature from 210°
C to 300°
C; and
immersing said substrate in an electroless solution of nickel, cobalt, gold or copper and depositing nickel, cobalt, gold or copper therefrom on the catalytic film formed by decomposition of said palladium or platinum complex. - View Dependent Claims (6, 7, 8)
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9. A method for the preparation of an inert substrate to electroless deposition of a metal upon said substrate comprising the steps of:
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a. applying to said substrate a thin film of a thermally decomposable coordination complex of palladium having the formula
space="preserve" listing-type="equation">LmPdXnwherein L = a ligand or unsaturated organic group, Pd is metal palladium and X = a halide, alkyl group or bidentate ligand, m is an integer from 1 to 4 and n is from 0 to 3, and b. exposing said substrate to which said complex has been applied, to heat, at a temperature of about 300°
C and less, to effect decomposition of said complex and create residue catalytic to a metal in an electroless bath. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification