Thermoelectric assembly and thermoelectric couples and subcouples therefor

• US 3,943,553 A
• Filed: 12/16/1974
• Issued: 03/09/1976
• Est. Priority Date: 06/14/1973
• Status: Expired due to Term

• Current Assignee: Sven T. Elfving, Thore M. Elfving
• Original Assignee: Sven T. Elfving, Thore M. Elfving
• Inventors: Elfving, Sven T., Elfving, Thore M.
• Primary Examiner(s): Miller, Jr., Stanley D.
• Assistant Examiner(s): Wojciechowicz, E.
• Application Number:
  US05/533,258
• Time in Patent Office: 449 Days
• Field of Search: 357/28, 357/68, 357/80, 357/81, 357/82, 357/87, 136/211, 136/212, 136/225
• US Class Current: 136/211
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: F25C 1/08 by immersing freezing chambers , cylindrical bodies or plates into water
• CPC Class Codes: H10N 10/13 characterised by the heat-exchanging means at the junction
• CPC Class Codes: H10N 10/817 the junction being non-separable, e.g. being cemented, sintered or soldered

Abstract

A thermoelectric assembly including a plurality of N-type and P-type semiconductor bodies interconnected by junction bridge elements. The junction bridge elements are in the form of thin sheets or plates of conductive material disposed edgewise with respect to the bodies and connected thereto by means of lips or tabs which extend perpendicular to the plane of the junction bridge element. A frame for directly engaging and holding the junction bridge elements and heat dissipating and absorbing means cooperate with the edges of the bridge elements.

Claims

1. A thermoelectric assembly comprising semiconductor bodies of P-type and N-type semiconductor material each having hot and cold sides of predetermined area with similar sides adapted to be connected in series by junction bridges to form thermocouples, characterized in that a contact member of substantially the same size and shape is secured to and contacts substantially the entirety of each of the sides of said bodies of semiconductor material, said junction bridges each having substantially the form of a thin sheet metal element disposed edgewise with its surfaces at substantially right angles with respect to the associated side and contact member of the semiconductor body with one edge in conductive contact with the contact member of the associated surface of an associated semiconductor body and with the other edge adapted to be associated with heat exchange means to the surrounding media, and a non-conductive supporting structure directly engaging said metal elements to support and protect the thermoelectric assembly.

2. A thermoelectric assembly as in claim 1 wherein said junction bridges each comprise a pair of thin sheet metal elements one connected to a P-type semiconductor body and the other to an N-type semiconductor body and connecting means for interconnecting the thin sheet metal elements to form junction bridges and connect the semiconductor bodies in series.

3. A thermoelectric assembly as in claim 1 wherein said junction bridges each comprise a single thin sheet metal element having one edge in conductive contact with one surface of a P-type and an N-type semiconductor body.

4. A thermoelectric assembly as in claim 1 including at least on one side a finned heat transfer member including a groove adapted to engage the other edge of an associated junction metal bridge element.

5. A thermoelectric assembly as in claim 1 wherein the thin sheet metal junction bridges connected to the cold junction side are extended to form a heat exchange means.

6. A thermoelectric assembly as in claim 5 wherein the extended junction bridges are adapted to be placed in contact with water for cooling or freezing the water.

7. A thermoelectric heat pump as in claim 1 wherein said one edge of said metal element in conductive contact with a semiconductor body includes a tab extending perpendicularly outward from the element and contacting the surface of the semiconductor body, said tab having substantially the same size and shape as the surface of the semiconductor body.

8. A thermoelectric subcouple as in claim 1 in which said one edge of the thin sheet metal bridge element includes a narrow portion extending to and contacting the contact member.

14. A thermoelectric assembly as in claim 1 in which the non-conductive supporting structure comprises a foam insulation directly engaging both sides of said sheet metal elements serving as junction bridges.

15. A thermoelectric assembly as in claim 1 wherein said non-conductive supporting structure comprises frame means directly engaging edges of said sheet metal element.

16. A thermoelectric assembly as in claim 7 wherein the junction bridge elements in the form of thin metal elements disposed edgewise to the surfaces of the semiconductor bodies are supported by a non-conductive structure in the form of a foam insulation directly engaging both sides of said thin metal elements.

9. A thermoelectric assembly comprising semiconductor bodies of N-type and P-type material having hot and cold surfaces connected in series by junction bridge elements to form thermocouples, said junction bridge elements having the form of thin metal elements having one edge in electrical and thermal contact with said surfaces and disposed edgewise with respect thereto with their surfaces substantially perpendicular to the surface of the semiconductor bodies and the other edge adapted to associate with heat exchange means, the hot and cold junction bridge elements having a minimum interfacing surface area whereby to minimize looses by heat exchange between the same.

10. A thermoelectric assembly as in claim 9 wherein said junction bridge elements each comprise at least a pair of metal thin elements one connected to a P-type semiconductor body and the other to an N-type semiconductor body and connecting means for interconnecting the metal elements to form junction bridges and connect the semiconductor bodies in series.

11. A thermoelectric assembly as in claim 9 wherein said junction bridges each comprise a single metal element with said one edge in contact with one surface of a P-type and an N-type semiconductor body.

12. A thermoelectric assembly as in claim 9 including heat transfer means in the form of finned heat transfer members each including an elongated groove adapted to engage the other edge of an associated metal bridge element.

13. A thermoelectric assembly as in claim 9 wherein said thin sheet metal junction bridges connected to the cold junction side are extended and adapted to be immersed in a fluid such as water to cool or freeze the same.