Thermoelectric assembly and thermoelectric couples and subcouples therefor
First Claim
1. A thermoelectric assembly comprising semiconductor bodies of P-type and N-type semiconductor material each having hot and cold sides of predetermined area with similar sides adapted to be connected in series by junction bridges to form thermocouples, characterized in that a contact member of substantially the same size and shape is secured to and contacts substantially the entirety of each of the sides of said bodies of semiconductor material, said junction bridges each having substantially the form of a thin sheet metal element disposed edgewise with its surfaces at substantially right angles with respect to the associated side and contact member of the semiconductor body with one edge in conductive contact with the contact member of the associated surface of an associated semiconductor body and with the other edge adapted to be associated with heat exchange means to the surrounding media, and a non-conductive supporting structure directly engaging said metal elements to support and protect the thermoelectric assembly.
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Abstract
A thermoelectric assembly including a plurality of N-type and P-type semiconductor bodies interconnected by junction bridge elements. The junction bridge elements are in the form of thin sheets or plates of conductive material disposed edgewise with respect to the bodies and connected thereto by means of lips or tabs which extend perpendicular to the plane of the junction bridge element. A frame for directly engaging and holding the junction bridge elements and heat dissipating and absorbing means cooperate with the edges of the bridge elements.
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Citations
16 Claims
- 1. A thermoelectric assembly comprising semiconductor bodies of P-type and N-type semiconductor material each having hot and cold sides of predetermined area with similar sides adapted to be connected in series by junction bridges to form thermocouples, characterized in that a contact member of substantially the same size and shape is secured to and contacts substantially the entirety of each of the sides of said bodies of semiconductor material, said junction bridges each having substantially the form of a thin sheet metal element disposed edgewise with its surfaces at substantially right angles with respect to the associated side and contact member of the semiconductor body with one edge in conductive contact with the contact member of the associated surface of an associated semiconductor body and with the other edge adapted to be associated with heat exchange means to the surrounding media, and a non-conductive supporting structure directly engaging said metal elements to support and protect the thermoelectric assembly.
- 9. A thermoelectric assembly comprising semiconductor bodies of N-type and P-type material having hot and cold surfaces connected in series by junction bridge elements to form thermocouples, said junction bridge elements having the form of thin metal elements having one edge in electrical and thermal contact with said surfaces and disposed edgewise with respect thereto with their surfaces substantially perpendicular to the surface of the semiconductor bodies and the other edge adapted to associate with heat exchange means, the hot and cold junction bridge elements having a minimum interfacing surface area whereby to minimize looses by heat exchange between the same.
Specification