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Thermoelectric assembly and thermoelectric couples and subcouples therefor

  • US 3,943,553 A
  • Filed: 12/16/1974
  • Issued: 03/09/1976
  • Est. Priority Date: 06/14/1973
  • Status: Expired due to Term
First Claim
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1. A thermoelectric assembly comprising semiconductor bodies of P-type and N-type semiconductor material each having hot and cold sides of predetermined area with similar sides adapted to be connected in series by junction bridges to form thermocouples, characterized in that a contact member of substantially the same size and shape is secured to and contacts substantially the entirety of each of the sides of said bodies of semiconductor material, said junction bridges each having substantially the form of a thin sheet metal element disposed edgewise with its surfaces at substantially right angles with respect to the associated side and contact member of the semiconductor body with one edge in conductive contact with the contact member of the associated surface of an associated semiconductor body and with the other edge adapted to be associated with heat exchange means to the surrounding media, and a non-conductive supporting structure directly engaging said metal elements to support and protect the thermoelectric assembly.

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