Functional package for complex electronic systems with polymer-metal laminates and thermal transposer

• US 3,952,231 A
• Filed: 09/06/1974
• Issued: 04/20/1976
• Est. Priority Date: 09/06/1974
• Status: Expired due to Term

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Williams, Richard A., Duffy, Michael C., Erickson, Alvard J., Gunther-Mohr, Gerard R., Davidson, Lewis A.
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US05/503,883
• Time in Patent Office: 592 Days
• Field of Search: 339/17 C, 339/17 L, 339/17 LM, 357/74, 357/80, 357/81, 357/84, 317/100, 317/101 D, 317/101 CP, 317/101 CM, 317/101 CC, 317/101 CE, 29/577, 29/626, 29/627, 174/68.5, 174/35, 174/DIG. 3, 174/DIG. 5, 174/15 R, 174/16 R
• US Class Current: 361/717
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/5383 Multilayer substrates H01L23/5385 takes precedence; multilayer metallisation on monolayer substrates H01L23/538
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/351 Thermal stress
• CPC Class Codes: H05K 1/142 Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit

Abstract

The package comprises a plurality of metal/polymer laminates whereby electronic components or functional units may be directly attached or plugged into laminated elements to form a unitary package. An element or thermal transposer is included in the package to minimize thermal expansion mismatch between the components and the laminates and conduct thermal energy away from the attached electronic components. The polymer laminates are selected to have a configuration and thermal coefficient of expansion (TCE) that will permit the insertion and locking of materials within the laminates to form the unitary package. A wide variety of components and functional units having different electrical, thermal characteristics may be included in the package. The package is amenable to mass production processes that may be controlled by a designer to obtain packages at a low cost, more flexibility and suitable for complex electronics system.

Claims

1. A functional package for complex electronic systems comprising,

a. a first member including a wiring plane and an opening,

b. an electrical package including polymer and metal laminates united as a composite and disposed in the opening of the first member,

c. a thermal transposer and heat conducting member included in the package, and

d. means for uniting and wiring together the first member and the electrical package as a unitary structure.

2. The functional package of claim 1 further including head radiator means connected to the thermal transposer and the first member is a polymer web.

3. The functional package of claim 1 wherein the first member is an appropriately webbed metal frame.

4. A functional package for complex electronic systems comprising,

a. a first polymer support member including a wiring plane and an opening,

b. an electrical package including polymer and metal laminates united as a composite and disposed in the opening of the first member,

c. means for uniting the electrical package and the first member as a unitary structure,

d. a semiconductor element attached to the electrical package, and

e. transposer means included in the electrical package to conduct thermal energy away from the semiconductor element and compensate for thermal coefficient expansion (TCE) mismatch between the semiconductor element and the electrical package.

5. The functional package of claim 4 wherein the transposer means has a TCE that is less than that of the first member.

6. The functional package of claim 4 wherein the transposer means is a laminate included in the electrical package beneath and insulated from the semiconductor element.

7. The functional package of claim 6 wherein the laminate is a metal alloy having a TCE approaching that for a semiconductor.

8. The functional package of claim 7 wherein a thermal radiator is connected to the metal alloy and further contributes to the removal of heat from the semiconductor.

9. A functional package for complex electronic systems comprising

a. a first supporting member,

b. a second member including polymer and metal laminates and a thermal transposer and heat conducting element united as a composite,

c. an electrical component directly attached to the second member, and

d. means for uniting the first and second members together as a composite functional package.

10. The functional package of claim 9 wherein the first member is of a material that has high thermal conduction properties.

11. The functional package of claim 9 wherein the first member is of a metallic material and the thermal transposer and heat conducting element is connected to a heat radiator.

12. A functional package for complex electronic systems comprising

a. a first metal support member having high thermal conductive and expansion properties, a heat radiator element attached to the metal support member,

b. a multi-layer conducting member, the member including insulating layers between the conductors,

c. the insulating material being of a composition that will not emit injurious vapors to conductive and semiconductive materials at temperatures exceeding ambient,

d. the multi-layer conducting member further including thermal transposer and heat conducting elements therein,

e. means for uniting the first and multi-layer members together as a composite functional package, and

f. a semiconductor device attached to the multi-layer conducting member.

13. The package of claim 12 wherein the insulating material is a polyamide.