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Solder glass with refractory filler

  • US 3,954,486 A
  • Filed: 07/30/1974
  • Issued: 05/04/1976
  • Est. Priority Date: 07/30/1974
  • Status: Expired due to Term
First Claim
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1. In a physical blend of particulate lead-borate solder glass and particulate low expansion refractory filler said filler having a coefficient of thermal expansion of less than about 65 ×

  • 10.sup.-7

    C (0-300°

    C), for use in thermal fusion sealing to a workpiece having a lower coefficient of thermal expansion than said solder glass, the improvement wherein said refractory filler has a particle size diameter in excess of about 37 microns and not substantially in excess of 150 microns whereby the flow is increased and the coefficient of thermal contraction is decreased upon fusion sealing when compared to the flow and thermal contraction properties of a blend of the same composition which has a refractory filler particle size substantially less than 37 microns in diameter.

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