Sensitized polyimides and circuit elements thereof

• US 3,954,570 A
• Filed: 11/11/1974
• Issued: 05/04/1976
• Est. Priority Date: 11/11/1974
• Status: Expired due to Term

• Current Assignee: AMP Limited
• Original Assignee: AMP Limited
• Inventors: Shirk, Albert, Ceresa, Myron
• Primary Examiner(s): Kendall, Ralph S.
• Assistant Examiner(s): Smith, John D.
• Application Number:
  US05/522,807
• Time in Patent Office: 540 Days
• Field of Search: 117/47 A, 117/46 FC, 117/212, 117/213, 117/93 CD, 117/47 H, 427/223, 427/225, 427/282, 427/98, 427/306, 204/38 B, 204/30, 118/47, 118/504
• US Class Current: 205/118
• CPC Class Codes: C23C 18/1605 by masking
• CPC Class Codes: C23C 18/1653 Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
• CPC Class Codes: C23C 18/2033 Heat
• CPC Class Codes: C23C 18/285 Sensitising or activating with tin based compound or composition
• CPC Class Codes: C23C 18/30 Activating or accelerating or sensitising with palladium or other noble metal
• CPC Class Codes: H05K 3/381 by special treatment of the substrate

Abstract

A process for preparation of an activated or sensitized polyimide polymer, deposition of various catalysts on the sensitized polymer and subsequent plating on said sensitized and catalyzed surface of a metal, e. g., nickel, cobalt, copper, or gold from an electroless bath; improved adhesion, avoidance of blistering, etc. are observed; the process is capable of producing useful printed circuits such as for mounting integrated circuit chips.

Claims

1. A process for depositing an electroless metal on a polyimide, the steps comprising:

a. masking a selected area on a polyimide surface;

b. exposing unmasked portions of said polyimide surface to an open flame;

c. contacting said unmasked and flame sensitized surfaces of said polyimide with a catalyst solution whereby a catalytic amount of a catalyst is deposited on said catalyzed polyimide; and

d. depositing on said catalyzed polyimide surface a metal from an electroless bath solution.

2. The process as defined in claim 1 and wherein the catalyst solution is a solution comprised of palladous chloride, stannous chloride, stannic chloride, and hydrochloric acid.

3. The process as defined in claim 1 and wherein masking of the polyimide surface is by a continuously moving flame resistant mask, said flame resistant mask being moved in unison with said polyimide surface.

4. The process as defined in claim 3 wherein the flame resistant mask is a continuous metal belt having a circuit pattern thereon at repeating intervals.

5. The process as defined in claim 1 wherein the masking is with a flame resistant continuously moving mask and a continuously fed polyimide film of a thickness of 1 to 5 mils.

6. The process as defined in claim 1 wherein said polyimide film in the unmasked portions thereof is exposed to a flame from a natural gas flame.

7. The process as defined in claim 6 wherein the polyimide surface is exposed to a butane and air combustion flame.

8. The process as defined in claim 1 wherein the polyimide surface sensitized by said flame is exposed to a catalytic solution comprising palladous chloride and hydrochloric acid, and an accelerator for said palladous chloride, said sensitized surface being exposed to said catalytic solution wherein palladium as a metal is of a concentration of 0.1 to 4 gr/liter.

9. The process as defined in claim 8 wherein the concentration of the solution is 0.1 to 1 gr/liter of Pd as a metal and the contacted catalyst solution is thereafter rinsed from said polyimide surface with deionized water.

10. The process as defined in claim 1 wherein nickel in an electroless bath is exposed to said catalyzed surfaces.

11. The process as defined in claim 10 and wherein nickel is deposited on said catalyzed polyimide film in a thickness of 5 to 10 micro inches and thereafter said nickel deposit built up with an electrolytically deposited copper layer.

12. The process as defined in claim 1 wherein the catalyzed surface is exposed to a copper, nickel, cobalt or gold in solution in an electroless bath.

13. The process as defined in claim 1 wherein electrolessly copper is deposited.

14. The process as defined in claim 1 wherein electrolessly cobalt is deposited.

15. The process as defined in claim 1 wherein electrolessly gold is deposited.