Printed circuit modules cooled by rack with forced air

• US 3,956,673 A
• Filed: 02/14/1974
• Issued: 05/11/1976
• Est. Priority Date: 02/14/1974
• Status: Expired due to Term

• Current Assignee: Lockheed Aircraft Corporation (Martin Marietta Corporation)
• Original Assignee: Lockheed Aircraft Corporation (Martin Marietta Corporation)
• Inventors: Seid, Gordon
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US05/442,664
• Time in Patent Office: 817 Days
• Field of Search: 317/100, 317/101 D, 317/101 DH, 317/101 CB, 174/15 R, 174/16 R, 165/76, 165/170, 62/418, 62/299
• US Class Current: 361/690
• CPC Class Codes: H05K 7/20572 within cabinets for removing heat from sub-racks, e.g. plenum

Abstract

An improved cooling system wherein printed circuit cards are made into modules of two cards each with an enclosed space between them inside the module. The modules cooperate with a rack which carries air passages, and upon connection of the module into the rack, air flows from one side of the rack through the module space, thus cooling the cards from their rear surfaces, thence out of the module, and returned via the other side of the rack.

Claims

1. An air-cooled circuit card module comprising at least one planar circuit card having a first surface for carrying circuit components thereon and a second surface on the opposite side of said card and lying in a plane parallel with respect to the plane of said first surface;

said module defining an enclosed space and having one interior wall thereof substantially defined by said second surface of said circuit card;

a rack having first and second sides;

means mounting said module in said rack and extending from side-to-side across said rack;

air passage means formed in each side of said rack; and

a hollow air pin having a first end connected to said module and extending through a wall thereof and having a second end extending into said air passage means in said rack for supplying air from one side of said rack into said enclosed space; and

means for returning said air from the other side of said enclosed space to the other side of said rack whereby heat is transferred away from said second surface of said circuit card.

2. The combination of claim 1 including a resilient grommet interposed between said air pin and said air passage means, whereby a seal is formed around said pin.

3. The combination of claim 1 including valve means mounted on said rack for closing the connection between said air supplying means and said module in the event said module is separated from said rack.

4. The combination of claim 3 wherein said valve means comprises a resilient grommet interposed between said air pin and said air passage means, whereby a seal is formed around said pin upon insertion of said pin through said grommet;

and, a spring-loaded hinge means mounted within said air passage means and normally abutting the underside of said grommet whenever said module is separated from said rack and being adapted to be pushed away from said grommet upon insertion of said air pin therethrough.