Method for the fabrication of printed circuits

• US 3,960,635 A
• Filed: 07/10/1974
• Issued: 06/01/1976
• Est. Priority Date: 06/07/1971
• Status: Expired due to Term

• Current Assignee: N.V. Hollandse Signaalapparaten
• Original Assignee: N.V. Hollandse Signaalapparaten
• Inventors: La Roy, Dick, Tengbergen, Erik Adriaan Willem Van Ebbenhorst
• Primary Examiner(s): Drummond, Douglas J.
• Assistant Examiner(s): Massie, Jerome W.
• Application Number:
  US05/486,976
• Time in Patent Office: 692 Days
• Field of Search: 156/285, 156/286, 156/288, 156/382, 156/295, 156/311, 156/312, 156/104, 174/68.5
• US Class Current: 156/286
• CPC Class Codes: B29C 2791/006 Using vacuum
• CPC Class Codes: B29C 43/3607 with sealing means or the like
• CPC Class Codes: B29C 43/56 Compression moulding under special conditions, e.g. vacuum
• CPC Class Codes: B32B 2309/68 Vacuum
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 37/0007 involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
• CPC Class Codes: B32B 37/1018 using only vacuum
• CPC Class Codes: H05K 2203/068 Features of the lamination press or of the lamination process, e.g. using special separator sheets
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence

Abstract

With a method for the fabrication of multilayers a laminate is obtained by the stacking of layers, which are formed by a carrier provided with a conductor pattern and interleaved by adhesive layers. The laminate is subjected to a process which is carried out in at least three phases: in the first phase moisture and air are extracted from the space in which the laminate is placed, in the second phase the laminate is pressed together under increasing temperature and in the third phase the pressing process is performed under another temperature rise to a certain maximum value and under a further increase in pressure, while air is admitted into the space where the laminate is situated.

Claims

1. A method of fabricating printed circuits composed of multiple layers, each of said layers formed by a carrier provided with a conductor pattern on at least one side, said layers being interleaved by adhesive layers, comprising the steps of:

stacking said layers onto each other;

interleaving adhesive layers between said layers to form a laminate;

clamping the laminate together;

evacuating the air from the space where the laminate is situated;

maintaining evacuation of the air during a first period of time such that moisture and air are extracted from the laminate;

pressing the laminate together under a first pressure while maintaining said evacuation during a second period of time, and increasing the temperature of the laminate during said second period, a rate of increase of temperature and duration of the second period being such that the adhesive melts and fills any voids between the layers and that during said second period said temperature remains below a value at which components of the adhesive required for hardening will be extracted, during said second period said first pressure being below a value at which the adhesive layers are pressed out of the laminate;

then admitting air into the space where the laminate is situated; and

pressing the laminate under a further increase in pressure for a third period of time while increasing the temperature of the laminate to a predetermined maximum value such that said adhesive hardens.

2. A method of fabricating printed circuits composed of multiple layers as claimed in claim 1, further comprising the steps of subjecting said laminate to a pressure for a fourth period of time in an unheated press, the value of said pressure corresponding approximately with that of the pressure applied during said second period of time.