Method of manufacturing a device comprising a semiconductor body

• US 3,968,565 A
• Filed: 01/09/1975
• Issued: 07/13/1976
• Est. Priority Date: 09/01/1972
• Status: Expired due to Term

• Current Assignee: US Philips Corporation (Koninklijke Philips N.V.)
• Original Assignee: US Philips Corporation (Koninklijke Philips N.V.)
• Inventors: Gerkema, Jan T., Van Dijk, Hendrikus Josephus Antonius, Bertens, Theodorus Cornelius Johannes Maria
• Primary Examiner(s): Tupman, W.
• Application Number:
  US05/539,784
• Time in Patent Office: 551 Days
• Field of Search: 29/580, 29/591, 29/602, 29/625, 29/603, 204/129.3, 204/129.35
• US Class Current: 438/3
• CPC Class Codes: G11B 5/3106 where the integrated or assembled structure comprises means for conditioning against physical detrimental influence, e.g. wear, contamination G11B5/3133 takes precedence
• CPC Class Codes: G11B 5/3163 Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
• CPC Class Codes: G11B 5/3183 intersecting the gap plane, e.g. "horizontal head structure"
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: H01L 21/3063 Electrolytic etching
• CPC Class Codes: Y10S 438/924 To facilitate selective etching
• CPC Class Codes: Y10T 29/49044 Plural magnetic deposition layers
• CPC Class Codes: Y10T 29/49064 by coating

Abstract

The invention relates to a method of manufacturing a device, for example, a magnetic head for recording and playing back information on a magnetisable medium.

In this method, a substrate of semiconductor material is profiled by a selective electrolytic etching process.

Preceding the etching process, the part of the substrate to be removed by said process is formed by a local doping treatment, for example, by diffusion.

The doping treatment may be carried out in several overlapping steps.

Claims

1. A method of manufacturing a film-deposited magnetic head comprising the steps of:

a. providing a semiconductor body having a flat major surface, said body having adjacent its flat major surface a semiconductor layer portion of high electrical resistivity,

b. introducing into the semiconductor body from its major surface to a depth less than that of the high resistance layer portion doping impurities to a concentration which when incorporated into the semiconductor body substantially reduces its resistivity, the distribution of said introduced impurities and its resultant profile substantially exactly corresponding to the negative of a non-planar profile which it is desired to shape into the body surface, said desired profile including body surface portions at plural levels.

c. thereafter subjecting the thus-doped body to a selective electrolytic etching process which operates to remove the doped surface portions of reduced resistivity but not the high resistivity portions until said doped surface portions are substantially entirely removed leaving intact deeper high resistivity portions forming the desired non-planar profile,

d. thereafter depositing on the non-planar profiled surface a continuous film of conductive material which extends over the different levels of the non-planar profile, and

e. thereafter completing by deposition electrical windings and a gapped magnetic circuit of the magnetic head utilizing the film of conductive material to form conductive elements recessed in some of the deeper areas of the non-planar profile.

2. A method as claimed in claim 1 wherein after step (c) but before step (d) an electrically insulating layer is formed on the non-planar profiled surface.

3. A method as claimed in claim 1, wherein an impurity masking layer is used for preventing introduction of doping impurities into some surface portions of the high resistivity layer portions in order to selectively dope other surface portions, said impurity masking layer is removed in its entirety from the major surface prior to the selective electrolytic etching step, and the selective electrolytic etching step is carried out without any etch-resistant masking layers present on the said major surface to be profiled.

4. A method as claimed in claim 3, wherein the impurity introduction step is carried out by diffusing the impurities in the body at an elevated temperature.

5. A method as claimed in claim 3, wherein the impurity is introduced by at least two steps, one step which causes introduction of impurity forming deep doped regions and another step which causes introduction of impurity forming less deep doped regions which partially overlap with the deep doped regions, both doped regions being substantially entirely removed during the electrolytic etching step.