Process for manufacturing printed substrates and decalcomania compositions used therefor

• US 3,981,761 A
• Filed: 08/27/1973
• Issued: 09/21/1976
• Est. Priority Date: 09/11/1972
• Status: Expired due to Term

• Current Assignee: Nippon TOKI Kabushiki Kaisha
• Original Assignee: Nippon TOKI Kabushiki Kaisha
• Inventors: Kojima, Yasuhiro, Nawa, Motoki, Matunaga, Niiti
• Primary Examiner(s): Drummond, Douglas J.
• Assistant Examiner(s): Ball, Michael W.
• Application Number:
  US05/392,001
• Time in Patent Office: 1,121 Days
• Field of Search: 156/230, 156/233, 156/239, 156/240, 156/247, 156/249, 156/288, 156/235, 161/406, 161/413, 161/DIG. 7, 117/3.6, 117/3.3, 117/76 P, 117/3.4, 117/212, 29/423, 428/914, 428/901, 427/146, 427/147, 427/151, 427/152
• US Class Current: 156/235
• CPC Class Codes: B41M 3/12 Transfer pictures or the like, e.g. decalcomanias processes for producing decorative surface effects B44C1/00; B41M5/0256 takes precedence
• CPC Class Codes: B44C 1/175 Transfer using solvent
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 1/167 incorporating printed resistors
• CPC Class Codes: H05K 2201/0284 Paper, e.g. as reinforcement paper sheet substrates H05K1/0386
• CPC Class Codes: H05K 2203/0531 Decalcomania, i.e. transfer of a pattern detached from its carrier before affixing the pattern to the substrate
• CPC Class Codes: H05K 2203/0786 Using an aqueous solution, e.g. for cleaning or during drilling of holes
• CPC Class Codes: H05K 3/207 using a prefabricated paste pattern, ink pattern or powder pattern
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10S 428/914 Transfer or decalcomania

Abstract

A process for the manufacture of printed substrates and decalcomania compositions used therefor comprising a permeable backing paper, water-soluble binder, printed pattern such as hybrid or monolithic circuit, and removable cover coat, these components being laminated one upon another.

Claims

1. A process for manufacturing a printed substrate comprising the steps of:

providing a decalcomania composition consisting of a permeable backing paper, a water-soluble binder coated thereon, a printed electric circuit pattern made of a conductor material or resistor material formed on the binder, and a removable cover coat formed on the printed pattern,

the removable cover coat consisting essentially of a member selected from the group of (1) silicone rubber, (2) a plastic film containing silicon rubber and (3) a film-forming coating material containing silicon rubber,

immersing said decalcomania composition in water to separate the paper from said printed conductor or resistor material-made pattern attached to the cover coat,

applying said printed pattern which is attached to the cover coat directly onto a flat or non-flat substrate substantially without any material between said printed pattern and said substrate, said substrate being of low porosity selected from the group consisting of alumina or fosterite,

peeling said cover coat off said printed pattern applied to the substrate, and

baking the printed pattern-applied substrate to obtain a conductor or resistor material pattern printed substrate, whereby the conductor or resistor pattern is baked substantially free of any material thereon which would have a deleterious effect on the performance of the resulting printed electric circuit.

2. A process according to claim 1, wherein the plastic film or film-forming coating material contains silicone rubber in amounts by weight of from 0.5 to 15%.

3. A process according to claim 1 wherein said pattern is made of a conductor material, and further repeating said steps using a pattern of a resistor material to thereby apply the resistor pattern material to the conductor pattern material to thereby obtain an electric circuit printed substrate.

4. A process according to claim 3 wherein the baking of the conductor and resistor material patterns is effected at the same time after they have been applied to the substrate.

6. A process according to claim 2 wherein the plastic film or film-forming coating material contains silicone rubber in amounts by weight of from 0.5 to 15%.

5. A process for manufacturing an electric circuit printed substrate comprising the steps of:

providing a decalcomania composition consisting of a permeable backing paper, a water-soluble binder coated thereon, a removable cover coat formed on the water-soluble binder and a printed electric circuit pattern made of a conductor material or a resistor material and formed on the removable cover coat,

the removable cover coat consisting essentially of a member selected from the group of (1) silicone rubber, (2) a plastic film containing silicone rubber and (3) a film-forming coating material containing silicone rubber,

immersing said decalcomania composition in water to separate the paper from said cover coat to which said printed, conductor or resistor material-made pattern is attached,

applying said printed pattern which is attached to said cover coat directly onto a flat or non-flat substrate substantially without any material between said printed pattern and said substrate, said substrate being of low porosity selected from the group consisting of alumina or fosterite,

peeling said cover coat off said printed pattern applied to the substrate, and

baking the printed pattern-applied substrate to obtain a conductor or resistor material pattern printed substrate, whereby the conductor or resistor pattern is baked substantially free of any material thereon which would have a deleterious effect on the performance of the resulting printed electric circuit.

7. A process according to claim 5 wherein said pattern is made of a conductor material, and further repeating said steps using a pattern of a resistor material to thereby apply the resistor pattern material to the conductor pattern material to thereby obtain an electric circuit printed substrate.

8. A process according to claim 7 wherein the baking of the conductor and resistor material patterns is effected at the same time after they have been applied to the substrate.