Metal-clad laminates

• US 3,984,598 A
• Filed: 02/08/1974
• Issued: 10/05/1976
• Est. Priority Date: 02/08/1974
• Status: Expired due to Term

• Current Assignee: Universal Oil Products Company (Honeywell International Inc.)
• Original Assignee: Universal Oil Products Company (Honeywell International Inc.)
• Inventors: Wilks, Alan D., Sarazin, Richard G.
• Primary Examiner(s): Ansher, Harold
• Assistant Examiner(s): Robinson, Ellis P.
• Application Number:
  US05/440,915
• Time in Patent Office: 970 Days
• Field of Search: 161/DIG. 7, 161/406, 161/165, 161/213, 161/186, 156/150, 156/151, 156/233, 156/246, 156/249, 156/272, 29/196.3, 29/195 P, 428/418, 428/457, 428/901, 428/202, 428/209, 428/210, 428/336, 204/15, 204/17, 204/20, 204/23, 204/35 R
• US Class Current: 428/336
• CPC Class Codes: B32B 15/08 of synthetic resin
• CPC Class Codes: B44C 1/14 Metallic leaves or foils, e.g. gold leaf
• CPC Class Codes: C25D 1/04 Wires; Strips; Foils
• CPC Class Codes: H05K 2201/0162 Silicon containing polymer, e.g. silicone
• CPC Class Codes: H05K 2201/0344 Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
• CPC Class Codes: H05K 2203/0152 Temporary metallic carrier, e.g. for transferring material affixing a prefabricated conductor pattern formed by electroplating or electroforming on a metallic carrier H05K3/205
• CPC Class Codes: H05K 2203/0156 Temporary polymeric carrier or foil, e.g. for processing or transferring
• CPC Class Codes: H05K 2203/0726 Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
• CPC Class Codes: H05K 3/025 by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
• CPC Class Codes: H05K 3/181 by electroless plating adhesives therefor H05K3/387
• CPC Class Codes: H05K 3/389 by the use of a coupling agent, e.g. silane
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/24926 including ceramic, glass, porcelain or quartz layer
• CPC Class Codes: Y10T 428/265 1 mil or less
• CPC Class Codes: Y10T 428/31529 Next to metal
• CPC Class Codes: Y10T 428/31678 Of metal

Abstract

Metal-clad laminates in which the metal coating of the laminate is only from about 1 micron to about 20 microns in thickness are prepared by depositing a copper coating on a substrate which has been treated with a release agent, treating the upper side of the metal layer to improve the adhesive properties of the metal, thereafter bonding the metal coating to a laminate and removing the substrate to thus prepare the desired metal-clad laminate.

Claims

1. A method for preparing a metal-clad laminate which comprises applying a release agent to a surface of a substrate, plating said surface with a conductive metal to a thickness of from 1 to about 20 microns, thereafter subjecting the resultant conductive metal layer to a high current density to roughen the exposed surface of the metal, then oxidizing said surface, thereafter contacting said surface with a bonding agent, bonding the thus treated conductive metal to a laminate, removing said substrate, and recovering the resultant metal-clad laminate.

2. The method as set forth in claim 1 in which said substrate is metallic in nature and said conductive metal is electrolytically deposited thereon.

3. The method as set forth in claim 1 in which said substrate is non-metallic in nature and said conductive metal is electrolessly deposited thereon.

4. The method as set forth in claim 1 in which said bonding of said conductive metal to said laminate is effected by applying heat and pressure to said laminate.

5. The method as set forth in claim 1 in which said conductive metal is copper.

6. The method as set forth in claim 1 in which said conductive metal is gold.

7. The method as set forth in claim 1 in which said conductive metal is nickel.

8. The method as set forth in claim 1 in which said conductive metal is tin.

9. The method as set forth in claim 1 in which said conductive metal is bonded to one side of said laminate.

10. The method as set forth in claim 1 in which said conductive metal is bonded to both sides of said laminate.

11. The method as set forth in claim 1 in which said laminate is a glass epoxy resin.

12. The method as set forth in claim 1 in which said laminate is a glass polyimide resin.

13. The method as set forth in claim 1 in which said laminate is a paper epoxy resin.

14. The method as set forth in claim 1 in which said laminate is a paper phenolic resin.

15. A metal-clad laminate prepared by the method of claim 1.

16. A metal-clad laminate prepared by the method of claim 5.

17. A metal-clad laminate prepared by the method of claim 6.

18. A metal-clad laminate prepared by the method of claim 7.

19. A metal-clad laminate prepared by the method of claim 8.

20. A metal-clad laminate prepared by the method of claim 11.

21. A metal-clad laminate prepared by the method of claim 12.

22. A metal-clad laminate prepared by the method of claim 13.

23. A metal-clad laminate prepared by the method of claim 14.

24. A metal-clad laminate prepared by the method of claim 1 and in which said laminate comprises a thermosetting resin.