Method of manufacturing semiconductor camera tube targets
First Claim
1. The method of manufacturing a camera tube target from a semiconductor material for placement in a camera tube prior to degassing thereof comprising the steps of initially doping the semiconductor material with an impurity for rendering it sensitive to a desired radiation spectrum but in a quantity less than required for sensitivity in said desired radiation spectrum;
- annealing said semiconductor material at a temperature greater than the subsequent degassing temperature for a period of time effective to increase the impurity concentration to a level sufficient to render the semiconductor material sensitive to the desired radiation spectrum, said concentration being substantially more stable at lower degassing temperatures than the initial impurity concentration;
positioning said semiconductor material as a target within a radiation sensitive camera tube enclosure; and
degassing said camera tube enclosure by heating said enclosure including said target for driving the gas from said enclosure.
0 Assignments
0 Petitions
Accused Products
Abstract
1. The method of manufacturing a camera tube target from a semiconductor material for placement in a camera tube prior to degassing thereof comprising the steps of initially doping the semiconductor material with an impurity for rendering it sensitive to a desired radiation spectrum but in a quantity less than required for sensitivity in said desired radiation spectrum; annealing said semiconductor material at a temperature greater than the subsequent degassing temperature for a period of time effective to increase the impurity concentration to a level sufficient to render the semicoductor material sensitive to the desired radiation spectrum, said concentration being substantially more stable at lower degassing temperatures than the initial impurity concentration; positioning said semiconductor material as a target within a radiation sensitive camera tube enclosure; and degassing said camera tube enclosure by heating said enclosure including said target for driving the gas from said enclosure.
3 Citations
8 Claims
-
1. The method of manufacturing a camera tube target from a semiconductor material for placement in a camera tube prior to degassing thereof comprising the steps of initially doping the semiconductor material with an impurity for rendering it sensitive to a desired radiation spectrum but in a quantity less than required for sensitivity in said desired radiation spectrum;
- annealing said semiconductor material at a temperature greater than the subsequent degassing temperature for a period of time effective to increase the impurity concentration to a level sufficient to render the semiconductor material sensitive to the desired radiation spectrum, said concentration being substantially more stable at lower degassing temperatures than the initial impurity concentration;
positioning said semiconductor material as a target within a radiation sensitive camera tube enclosure; and
degassing said camera tube enclosure by heating said enclosure including said target for driving the gas from said enclosure.
- annealing said semiconductor material at a temperature greater than the subsequent degassing temperature for a period of time effective to increase the impurity concentration to a level sufficient to render the semiconductor material sensitive to the desired radiation spectrum, said concentration being substantially more stable at lower degassing temperatures than the initial impurity concentration;
-
2. The method of manufacturing a camera tube target from a semiconductor material for inclusion in a camera tube prior to degassing thereof at temperatures lower than 300°
- C comprising the steps of diffusing an acceptor type impurity into a body of initially n-type semiconductor material at an elevated temperature higher than 700°
C;
said temperature being sufficient to dope said semiconductor with acceptor type impurity metal in the range from one-third to one-half the n-type impurity by atomic percentage; and
annealing said target at a temperature higher than said degassing temperature but lower than 700°
C causing the effective acceptor concentration to increase while rendering the target stable during degassing procedures.
- C comprising the steps of diffusing an acceptor type impurity into a body of initially n-type semiconductor material at an elevated temperature higher than 700°
-
3. The method of manufacturing a camera tube target from semiconductor material for inclusion in a camera tube prior to degassing thereof at temperatures lower than 300°
- C comprising the steps of coating a body of initially n-type semiconductor material with an acceptor-type impurity metal;
heating the coated body to a temperature higher than the degassing temperature to cause the metal to diffuse into the semiconductor;
said temperature being sufficient to dope said semiconductor with acceptor-type impurity metal in the range from one-third to one-half the n-type impurity by atomic percentage;
removing said metal coating; and
annealing said target at a temperature higher than said degassing temperature but less than the diffusing temperature of said acceptor-type impurity causing the effective acceptor concentration to increase in approximate balance with the n-type impurity and rendering the target stable during degassing procedures.
- C comprising the steps of coating a body of initially n-type semiconductor material with an acceptor-type impurity metal;
-
4. The method of manufacturing a camera tube target from germanium semiconductor material for placement in a camera tube prior to degassing thereof at temperatures lower than from 250°
- C to 300°
C comprising the steps of diffusing copper into a body of initially n-type germanium at an elevated temperature higher than said degassing temperature which is effective to dope said semiconductor with copper in the range of from one-third to one-half the n-type impurity contained in said germanium by atomic percentage, and annealing said target at a temperature higher than said degassing temperature but lower than said diffusion temperature causing the effective acceptor concentration to increase to a range characteristic of copperII doped germanium while rendering the target stable for degassing procedures.
- C to 300°
-
5. A method of manufacturing a camera tube target from germanium semiconductor material for placement in a camera tube prior to degassing thereof at temperatures lower than 300°
- C comprising the steps of coating a body of initially n-type impurity containing germanium with an acceptor-type impurity metal;
heating the coated body to a temperature higher than 700°
C to cause the metal to diffuse into the germanium;
said temperature being sufficient to saturate said germanium with acceptor-type impurity metal in the range of from one-third to one-half the n-type impurity by atomic percentage as determined by the temperature-solubility characteristic of the acceptor impurity in germanium;
removing said metal coating; and
annealing said body at a temperature between 300°
C and 500°
C for a time sufficient for causing the effective acceptor concentration to increase to a substantially maximum value in approximate balance with the n-type impurity and rendering the target stable for subsequent degassing procedures. - View Dependent Claims (6)
- C comprising the steps of coating a body of initially n-type impurity containing germanium with an acceptor-type impurity metal;
-
7. A method of manufacturing a camera tube target from germanium semiconductor material for placement in a camera tube prior to degassing thereof at temperatures lower than 300°
- C comprising the steps of coating a body of initially n-type impurity containing germanium with copper;
heating the coated body to a temperature higher than 700°
C to cause the copper to diffuse into the germanium, said temperature being sufficient to saturate said germanium with copper in the range of from one-third to one-half the n-type impurity by atomic percentage as determined by the temperature-solubility characteristic of copper in germanium;
removing said copper coating;
subjecting a surface of said body to ion-glow discharge; and
annealing said body at a temperature between 300°
C and 500°
C for a time sufficient for causing the effective acceptor concentration to increase to a maximum approximating 95% of the n-type impurity, rendering the target stable for subsequent degassing procedures.
- C comprising the steps of coating a body of initially n-type impurity containing germanium with copper;
-
8. The method of manufacturing a camera tube target from germanium semiconductor material for placement in a camera tube prior to degassing thereof at a temperature lower than 300°
- C comprising the steps of diffusing copper into a body of initially n-type germanium at an elevated temperature higher than said degassing temperature which is effective to dope said semiconductor with copper in the range of from one-third to one-half the n-type impurity contained in said germanium by atomic percentage and annealing said target at a temperature between 300°
C and 475°
C for a time between ten hours and ten minutes in inverse relation to the temperature employed, for rendering the target suitably radiation sensitive and stable during degassing procedures.
- C comprising the steps of diffusing copper into a body of initially n-type germanium at an elevated temperature higher than said degassing temperature which is effective to dope said semiconductor with copper in the range of from one-third to one-half the n-type impurity contained in said germanium by atomic percentage and annealing said target at a temperature between 300°
Specification