Direct bonding of metals to ceramics and metals

• US 3,994,430 A
• Filed: 07/30/1975
• Issued: 11/30/1976
• Est. Priority Date: 07/30/1975
• Status: Expired due to Term

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Cusano, Dominic A., Loughran, James A., Sun, Yen Sheng Edmund
• Primary Examiner(s): Smith, Al Lawrence
• Assistant Examiner(s): Joyce, Margaret
• Application Number:
  US05/600,300
• Time in Patent Office: 489 Days
• Field of Search: 228/122, 228/123, 228/124, 228/193-198, 228/208, 228/209, 228/238, 228/903
• US Class Current: 228/122.1
• CPC Class Codes: B23K 1/19 taking account of the properties of the materials to be soldered
• CPC Class Codes: B23K 35/001 Interlayers, transition pieces for metallurgical bonding of workpieces
• CPC Class Codes: B23K 35/24 Selection of soldering or welding materials proper B23K35/34 takes precedence
• CPC Class Codes: C04B 2237/06 Oxidic interlayers
• CPC Class Codes: C04B 2237/343 Alumina or aluminates
• CPC Class Codes: C04B 2237/407 Copper
• CPC Class Codes: C04B 2237/54 Oxidising the surface before joining
• CPC Class Codes: C04B 2237/567 made of metal
• CPC Class Codes: C04B 2237/708 of one or more of the interlayers
• CPC Class Codes: C04B 2237/76 Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc
• CPC Class Codes: C04B 37/026 consisting of metals or metal salts
• CPC Class Codes: H01L 2224/37099 Material
• CPC Class Codes: H01L 2224/40091 Arched
• CPC Class Codes: H01L 2224/84801 Soldering or alloying
• CPC Class Codes: H01L 24/34 Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/40 of an individual strap connector
• CPC Class Codes: H01L 24/84 using a strap connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H05K 1/0306 : Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 2201/0355 : Metal foils
• CPC Class Codes: H05K 3/202 : using self-supporting metal foil pattern
• CPC Class Codes: H05K 3/38 : Improvement of the adhesion between the insulating substrate and the metal
• CPC Class Codes: Y10S 228/903 : Metal to nonmetal

Abstract

Disclosed is a method of bonding metals to substrates such as ceramics or metals. A bonding agent forms a eutectic alloy with the metal to provide bonding. Several methods of supplying the bonding agent to the system are disclosed. However, regardless of which method of introducing the bonding agent into the system is employed, the quantity of the bonding agent is carefully controlled so that the compound in the region of the bond is hypoeutectic. To form the bond, the metal and the substrate are placed adjacent each other and the bonding agent is introduced into the system. The system is then heated to a temperature between the eutectic temperature and the melting point of the metal for a preselected time. The system is then cooled to form a bond. The heating is carried out in an inert atmosphere or a vacuum.

Claims

1. A method of bonding a metal to a substrate comprising the steps of:

selecting a substrate from the group consisting of ceramics and metals,

selecting a metal which will form a direct bond with said substrate;

providing a bonding agent compatible with said substrate, said bonding agent being one which forms a eutectic alloy with said metal, said eutectic alloy consisting predominately of said metal and having a eutectic temperature lower than the melting point of said metal;

positioning said metal on said substrate;

simultaneously exposing the interface between said metal and said substrate to a solid state source of said bonding agent by having said source in direct contact with said metal, and heating said metal and said substrate in an inert atmosphere to a temperature between said eutectic temperature and said melting point for at least a few seconds to form a melt at the interface between said metal and said substrate, wherein said steps of exposing and heating are carried out such that said melt is at least ultimately hypoeutectic; and

cooling said melt to form a direct bond between said metal and said substrate.

2. A method according to claim 1 wherein said exposing and heating steps are carried out such that the bulk of said metal remains in the solid phase.

3. A method according to claim 2 wherein said solid state source is a layer of a compound of said metal and said bonding agent on said metal, said layer being very thin as compared to said metal.

4. A method according to claim 3 wherein said layer is on the side of said metal opposite that side which forms said interface.

5. A method according to claim 3 wherein said layer is on the side of said metal that forms said interface.

6. A method according to claim 3 wherein said layer comprises said compound in a particulate form and a vehicle.

7. A method according to claim 6 wherein said vehicle is an organic compound that vaporizes during said heating step.

8. A method according to claim 6 wherein said layer also comprises said metal in particulate form.

9. A method according to claim 2 further comprising passing said substrate with said metal thereon through a tunnel oven to form bonds.

10. A method according to claim 2 wherein, on a phase diagram of said metal and said bonding agent, the absolute slope of a line connecting said melting point and the eutectic point is between 1°

and 100°

Celsius per atomic percent of bonding agent at said eutectic point.

11. A method according to claim 10 wherein said slope is approximately 10°

Celsius per atomic percent of bonding agent.

12. A method of bonding a metal to a substrate comprising the steps of:

selecting a substrate from the group consisting of ceramics and metals;

selecting a metal which will form a direct bond with said substrate;

selecting a bonding agent compatible with said substrate, said bonding agent being one which forms a eutectic alloy with said metal, said eutectic alloy consisting predominately of said metal and having a eutectic temperature lower than the melting point of said metal;

reacting said metal with a small amount of said bonding agent;

positioning said metal on said substrate;

heating said metal and said substrate in an inert atmosphere to a temperature between said eutectic temperature and said melting point for at least a few seconds to form a melt at the interface between said metal and said substrate, wherein said steps of reacting and heating are controlled so that the melt is hypoeutectic; and

cooling said metal and said substrate to form a bond.

13. A method according to claim 12 wherein said exposing and heating steps are carried out such that most of said metal remains in the solid phase.

14. A method according to claim 13 wherein said step of reacting comprises forming a layer of a compound of said bonding agent and said metal, said layer being very thin as compared to said metal.

15. A method according to claim 14 wherein said layer is on the side of said metal opposite that side which forms said interface.

16. A method according to claim 14 wherein said layer is on the side of said metal that forms said interface.

17. A method according to claim 14 wherein said layer is formed chemically.

18. A method according to claim 14 wherein said layer is formed thermally.

19. A method of bonding a metal to a substrate comprising the steps of:

selecting a substrate from the group consisting of ceramics and metals;

selecting a metal which will form a direct bond with said substrate, where said metal contains a quantity of a bonding agent which is compatible with said substrate and forms a eutectic alloy with said metal, said eutectic alloy consisting predominately of said metal and having a eutectic temperature lower than the melting point of said metal, said quantity of bonding agent being in the range of about 100 to 2,000 parts per million parts of said metal;

positioning said metal on said substrate;

heating said metal and said substrate in an inert atmosphere to a temperature between said eutectic temperature and said melting point for at least a few seconds to form a melt between said metal and said substrate; and

cooling said metal and said substrate to form a bond.

20. A method according to claim 19 wherein said exposing and heating steps are carried out such that the bulk of said metal remains in the solid phase.

21. A method according to claim 19 further comprising passing said substrate with said metal thereon through a tunnel oven to form bonds.

22. A method according to claim 19 wherein, on a phase diagram of said metal and said bonding agent, the slope of a line connecting said melting point and the eutectic point is between 1°

and 100°

Celsius per atomic percent of bonding agent at said eutectic point.

23. A method according to claim 22 wherein said slope is approximately 10°

Celsius per atomic percent of bonding agent.

24. A method of bonding copper to a substrate comprising the steps of:

selecting a substrate from the group consisting of ceramics and metals;

oxidizing at least one surface of a sheet of copper to a thickness in the range of about 200 Angstroms to about 5,000 Angstroms;

positioning said copper on said substrate; and

heating said copper and said substrate in an inert atmosphere to a temperature between 1065° and

1083°

Celsius for a time sufficient to form a hypoeutectic melt at the interface between said copper and said substrate; and

cooling said copper and said substrate to form a bond.

25. A method according to claim 24 wherein said exposing and heating steps are carried out such that the bulk of said copper remains in the solid phase.

26. A method according to claim 24 where said oxidized surface is the side of said copper opposite that side which is adjacent said substrate.

27. A method according to claim 24 wherein said oxidized surface is the side of said copper that forms said interface.

28. A method according to claim 27 further comprising passing said substrate with said copper thereon through a tunnel oven to form bonds.

29. A method according to claim 24 wherein said heating step is carried on such that said copper and said substrate are above 1065°

C for a period of a few seconds to several minutes.

30. A method according to claim 24 wherein said copper is oxidized chemically.

31. A method according to claim 24 wherein said copper is oxidized thermally.

32. A method according to claim 24 wherein said substrate is ceramic.

33. A method according to claim 24 wherein said copper is oxidized on both surfaces.

34. A method according to claim 24 wherein said copper is about 10 mils thick.

35. A method of bonding copper to a substrate comprising the steps of:

selecting a substrate from the group consisting of metals and ceramics;

selecting copper containing from about 100 to about 2,000 parts per million oxygen distributed therein;

positioning said copper on said substrate;

heating said copper and said substrate in an inert atmosphere to a temperature between 1065° and

1083°

Celsius for a time sufficient to form a hypoeutectic melt between said copper and said substrate; and

cooling said copper and said substrate to form a direct bond.

36. A method according to claim 35 wherein said exposing and heating steps are carried out such that most of said copper remains in the solid phase.

37. A method according to claim 35 wherein said copper is electrolytic tough pitch copper.

38. A method according to claim 35 wherein said substrate is ceramic.

39. A method of making a circuit board comprising the steps of:

selecting a ceramic substrate;

selecting for conductive leads, a metal which will form a direct bond with said substrate;

providing a bonding agent compatible with said substrate, said bonding agent being one which forms a eutectic alloy with said metal, said eutectic alloy consisting predominately of said metal and having a eutectic temperature lower than the melting point of said metal;

positioning said metal on said substrate;

simultaneously exposing the interface between said metal and said substrate to a solid state source of said bonding agent by having said source in direct contact with said metal, and heating said metal and said substrate in an inert atmosphere to a temperature between said eutectic temperature and said melting point for at least a few seconds to form a melt at the interface between said metal and said substrate, wherein said steps of exposing and heating are carried out such that said melt is at least ultimately hypoeutectic; and

cooling said melt to form a direct bond between said metal and said substrate.

40. A method according to claim 39 wherein said metal is patterned.

41. A method according to claim 39 wherein said metal comprises a plurality of land areas interconnected by support means and wherein said method further comprises, following said cooling step, a step of removing said support means.

42. A method according to claim 41 wherein said metal comprises relatively small tabs coupling said support means and said lands, and said support means is separated from, and thus not bonded to, said substrate, and said step of removing said support means comprises breaking said tabs.

43. A method according to claim 42 wherein said tabs are notched.

44. A method according to claim 42 wherein said metal is copper, said bonding agent is oxygen, and said substrate is selected from the group consisting of alumina and beryllia.