Integrated circuit device employing metal frame means with preformed conductor means

• US 4,003,073 A
• Filed: 10/10/1972
• Issued: 01/11/1977
• Est. Priority Date: 06/29/1970
• Status: Expired due to Term

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Geyer, Harry J., Helda, Robert W.
• Primary Examiner(s): Wojciechowicz, Edward J.
• Application Number:
  US05/296,186
• Time in Patent Office: 1,554 Days
• Field of Search: 317/234, 317/3, 317/5.4, 357/68, 357/69, 357/70, 357/72, 357/73
• US Class Current: 257/695
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48 of an individual wire connector
• CPC Class Codes: H01L 2224/85201 Compression bonding
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49524 the additional leads being a tape carrier or flat leads
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/50 Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto thin flexible metallic tape with or without a film carrier H01L23/49572, flexible insulating substrates H01L23/4985, H01L23/5387
• CPC Class Codes: H01L 24/86 using tape automated bonding [TAB]
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01028 Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 : Integrated circuits

Abstract

Wire bonding is eliminated in the assembly of microelectronic devices, by a process involving the direct bonding of circuit electrodes to an unsupported metallic sheet-frame member having a plurality of inwardly extending leads. A single-step vibratory pressure welding technique is employed for the simultaneous bonding of all leads to a semiconductor integrated circuit chip. Lateral confinement of the leads during the bonding steps causes a buckling action to introduce a small but critical loop in each lead to ensure clearance between the lead fingers and the perimeter of the semiconductor chip, whereby electrical shorting is avoided. The loop also provides a structural flexibility in the leads, which tends to protect the bonding sites from excessive stresses. Subsequently, the first frame member including the bonded circuit is attached, preferably by resistance welding, to a second lead frame member of heavier gage and increased dimensions, suitable for connection with external circuitry. Excess portions of the first frame member are then removed, providing a completed assembly for packaging; e.g., plastic encapsulation or hermetic sealing, as in a ceramic-glass flat package.

Claims

1. An integrated circuit semiconductor device adapted to be produced with automated steps in the assembly thereof, said device including metal portions within housing means and extending outside said housing means for such device, said metal portions all having been originally a part of a substantially one piece flat metal strip including a plurality of lead frame sections in the strip and each lead frame section having a plurality of leads comprising said ultimate metal portions of the semiconductor device, each said metal portion in said device having an inner portion extending toward an originally open central area in the original frame section and an outer portion extending outwardly therefrom, said original metal strip and each integral frame section thereof being less than 4.0 mils thick and characterized by a flexibility such that the metal strip with an integrated circuit semiconductor unit bonded to the leads of each frame section thereof can be wound on a spool for handling said strip from which said strip is unwound for use as needed in the manufacture of semiconductor devices, said semiconductor device having an integrated circuit semiconductor unit positioned at said central area and bonded to said inner lead portion of each lead in a frame section by means of a single bonding step, housing means for a portion of each of said metal portions and the semiconductor unit bonded thereto, and with a portion of each original frame section being severable from the outer portions of said original leads to separate each lead from the others in a frame section, said housing means being round in configuration and with the outer portions of each metal portion in the device extending in a spaced apart circular pattern outside said housing means for connecting the semiconductor device with apparatus in which the device is to be used.

2. In an integrated circuit semiconductor device as defined in claim 1, wherein the housing means includes a pair of round ceramic discs with one disc on each side of the device.